JPS556843A - Semiconductor control rectifying device - Google Patents

Semiconductor control rectifying device

Info

Publication number
JPS556843A
JPS556843A JP7897978A JP7897978A JPS556843A JP S556843 A JPS556843 A JP S556843A JP 7897978 A JP7897978 A JP 7897978A JP 7897978 A JP7897978 A JP 7897978A JP S556843 A JPS556843 A JP S556843A
Authority
JP
Japan
Prior art keywords
shaped metal
metal plate
ring
semiconductor control
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7897978A
Other languages
Japanese (ja)
Inventor
Takashi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP7897978A priority Critical patent/JPS556843A/en
Publication of JPS556843A publication Critical patent/JPS556843A/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To simplify the production process through simultaneous brazing of a current conducting body in the brazing of a semiconductor control rectifying element to a stem.
CONSTITUTION: A radiation member 1 is bonded on the first end of an insulated ring 3 through a ring-shaped metal plate 4' while a ring shaped metal plate 4" on the second end thereof. The insulated ring 3 is provided with strip-shaped metal plates 5' and 6'. An anode electrode of a semiconductor control rectifier 2 is brazed on the radiation member 1 of a stem, one end of a current conducting body 7 connected to a cathod electrode, on the strip-shaped metal plate 5' and one end of a current conducting body 8 connected to a gate electrode, on the strip-shaped metal plate 6'. In addition, the ring-shaped metal plate 4" and the end of a cap composed of a metal disc 9 covering thereof are sealed airtight.
COPYRIGHT: (C)1980,JPO&Japio
JP7897978A 1978-06-28 1978-06-28 Semiconductor control rectifying device Pending JPS556843A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7897978A JPS556843A (en) 1978-06-28 1978-06-28 Semiconductor control rectifying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7897978A JPS556843A (en) 1978-06-28 1978-06-28 Semiconductor control rectifying device

Publications (1)

Publication Number Publication Date
JPS556843A true JPS556843A (en) 1980-01-18

Family

ID=13677002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7897978A Pending JPS556843A (en) 1978-06-28 1978-06-28 Semiconductor control rectifying device

Country Status (1)

Country Link
JP (1) JPS556843A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143241A (en) * 1987-11-30 1989-06-05 Nec Corp Manufacture of semiconductor device package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143241A (en) * 1987-11-30 1989-06-05 Nec Corp Manufacture of semiconductor device package

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