JPS5476063A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5476063A
JPS5476063A JP14432077A JP14432077A JPS5476063A JP S5476063 A JPS5476063 A JP S5476063A JP 14432077 A JP14432077 A JP 14432077A JP 14432077 A JP14432077 A JP 14432077A JP S5476063 A JPS5476063 A JP S5476063A
Authority
JP
Japan
Prior art keywords
insulator
electrode
soldered
secure
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14432077A
Other languages
Japanese (ja)
Other versions
JPS5841771B2 (en
Inventor
Mitsuo Odate
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP14432077A priority Critical patent/JPS5841771B2/en
Priority to US05/957,330 priority patent/US4274106A/en
Priority to DE2848252A priority patent/DE2848252C2/en
Publication of JPS5476063A publication Critical patent/JPS5476063A/en
Publication of JPS5841771B2 publication Critical patent/JPS5841771B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To increase the current square time product value to secure the anti- explosion quantity by inserting the elastic shielding substance into the opposing area between the insulator and the 1st and 2nd main electrodes.
CONSTITUTION: The 1st and 2nd main electrode 6 and 7 are provided holding the semiconductor element between, and insulator 8 is provided enclosing the outer circumference of the contact areas of electrode 6 and 7 to the semiconductor element. Then the inner circumference part of flexible metal plate 9 made of the copper thin plate is soldered to electrode 6, and the outer circumference part is soldered to the end face of insulator 8 respectively. As a result, the current square time product value is increased to secure the anti-explosion quantity.
COPYRIGHT: (C)1979,JPO&Japio
JP14432077A 1977-11-07 1977-11-30 semiconductor equipment Expired JPS5841771B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP14432077A JPS5841771B2 (en) 1977-11-30 1977-11-30 semiconductor equipment
US05/957,330 US4274106A (en) 1977-11-07 1978-11-03 Explosion proof vibration resistant flat package semiconductor device
DE2848252A DE2848252C2 (en) 1977-11-07 1978-11-07 Semiconductor component and method for its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14432077A JPS5841771B2 (en) 1977-11-30 1977-11-30 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5476063A true JPS5476063A (en) 1979-06-18
JPS5841771B2 JPS5841771B2 (en) 1983-09-14

Family

ID=15359341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14432077A Expired JPS5841771B2 (en) 1977-11-07 1977-11-30 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5841771B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (en) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー Power semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017506819A (en) * 2014-01-21 2017-03-09 アーベーベー・テクノロジー・アーゲー Power semiconductor device

Also Published As

Publication number Publication date
JPS5841771B2 (en) 1983-09-14

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