JPS5276877A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5276877A
JPS5276877A JP50153647A JP15364775A JPS5276877A JP S5276877 A JPS5276877 A JP S5276877A JP 50153647 A JP50153647 A JP 50153647A JP 15364775 A JP15364775 A JP 15364775A JP S5276877 A JPS5276877 A JP S5276877A
Authority
JP
Japan
Prior art keywords
semiconductor device
facedownbonding
direct
transparent electrode
production cost
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50153647A
Other languages
Japanese (ja)
Inventor
Yoshiharu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP50153647A priority Critical patent/JPS5276877A/en
Publication of JPS5276877A publication Critical patent/JPS5276877A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To reduce production cost and to increase reliability by direct facedownbonding of metallic contact region of semiconductor device to transparent electrode using conductive paste.
COPYRIGHT: (C)1977,JPO&Japio
JP50153647A 1975-12-22 1975-12-22 Semiconductor device Pending JPS5276877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50153647A JPS5276877A (en) 1975-12-22 1975-12-22 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50153647A JPS5276877A (en) 1975-12-22 1975-12-22 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5276877A true JPS5276877A (en) 1977-06-28

Family

ID=15567095

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50153647A Pending JPS5276877A (en) 1975-12-22 1975-12-22 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5276877A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010735A (en) * 1983-06-30 1985-01-19 Toshiba Corp Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6010735A (en) * 1983-06-30 1985-01-19 Toshiba Corp Semiconductor device
JPH0469428B2 (en) * 1983-06-30 1992-11-06 Tokyo Shibaura Electric Co

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