JPS54155767A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54155767A
JPS54155767A JP6467078A JP6467078A JPS54155767A JP S54155767 A JPS54155767 A JP S54155767A JP 6467078 A JP6467078 A JP 6467078A JP 6467078 A JP6467078 A JP 6467078A JP S54155767 A JPS54155767 A JP S54155767A
Authority
JP
Japan
Prior art keywords
cap
ring
semiconductor device
pentagon
seam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6467078A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP6467078A priority Critical patent/JPS54155767A/en
Publication of JPS54155767A publication Critical patent/JPS54155767A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To reduce leak defects greatly as to a semiconductor device, whose container and cap are seam-welded, by forming a welding part in a polygonal shape more than a pentagon with its inner angle more than 90°.
CONSTITUTION: On alumina ceramic base 2, a semiconductor device is fixed, external lead 3 is led out, and ring-shaped alumina ceramic weld ring 4 is bonded on base 2 surrounding the semiconductor device. On it, nickel-plating Kovar cap 6 is mounted via metallized layer 5 and a current is flowed between metallized layer 5 and seam-weld electrode 9 pushed against one terminal of the cap, thereby fixing cap 6. As for the shapes of ring 4 and cap 6 in this constitution, ring circumference 10' and cap circumference 11' are made polygonal more than a pentagon such as an octagon as shown in the figure and the inner angle is made more than 90° to allow both circumferences to match each other. Consequently, even if a mutual shift in position occurs during the fixing operation, no leak defect occurs.
COPYRIGHT: (C)1979,JPO&Japio
JP6467078A 1978-05-29 1978-05-29 Semiconductor device Pending JPS54155767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6467078A JPS54155767A (en) 1978-05-29 1978-05-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6467078A JPS54155767A (en) 1978-05-29 1978-05-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54155767A true JPS54155767A (en) 1979-12-08

Family

ID=13264844

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6467078A Pending JPS54155767A (en) 1978-05-29 1978-05-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54155767A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274054A (en) * 1988-09-09 1990-03-14 Nec Kyushu Ltd Sealing method of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0274054A (en) * 1988-09-09 1990-03-14 Nec Kyushu Ltd Sealing method of semiconductor device

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