JPS56101761A - Airtight package for integrated circuit - Google Patents

Airtight package for integrated circuit

Info

Publication number
JPS56101761A
JPS56101761A JP436180A JP436180A JPS56101761A JP S56101761 A JPS56101761 A JP S56101761A JP 436180 A JP436180 A JP 436180A JP 436180 A JP436180 A JP 436180A JP S56101761 A JPS56101761 A JP S56101761A
Authority
JP
Japan
Prior art keywords
plating
base
conducted
gold
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP436180A
Other languages
Japanese (ja)
Other versions
JPS6122864B2 (en
Inventor
Tetsushi Ishida
Seizo Akasaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP436180A priority Critical patent/JPS56101761A/en
Publication of JPS56101761A publication Critical patent/JPS56101761A/en
Publication of JPS6122864B2 publication Critical patent/JPS6122864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

PURPOSE:To enable to use a laser welding machine even for a package having a complicated shape by gold plating a part to be welded to the semiconductor of a base and plating with nongloss on the part to be welded to the can member of the base and the outer periphery in the vicinity of the part. CONSTITUTION:A lower plating layer is formed on the base material 4, and the gold is plated thereon. The can 10 is formed by plating nickel on a material such as kovar, and nonglossy plating is conducted without gold plating on the part superposed with the base 1 and the outer periphery 11 of the base. Since the nonglossy plating is conducted in this manner, even the package having complicated shape can not almost reflect the laser light, but can efficiently absorb it. Accordingly, hermetic seal can be conducted by using the laser welding machine, and welding locus can be controlled.
JP436180A 1980-01-18 1980-01-18 Airtight package for integrated circuit Granted JPS56101761A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP436180A JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP436180A JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Publications (2)

Publication Number Publication Date
JPS56101761A true JPS56101761A (en) 1981-08-14
JPS6122864B2 JPS6122864B2 (en) 1986-06-03

Family

ID=11582231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP436180A Granted JPS56101761A (en) 1980-01-18 1980-01-18 Airtight package for integrated circuit

Country Status (1)

Country Link
JP (1) JPS56101761A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989003123A1 (en) * 1987-09-25 1989-04-06 Aegis, Inc. Microcircuit package with corrosion resistant pins and methof of making
US5093282A (en) * 1988-04-13 1992-03-03 Kabushiki Kaisha Toshiba Method of making a semiconductor device having lead pins and a metal shell

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989003123A1 (en) * 1987-09-25 1989-04-06 Aegis, Inc. Microcircuit package with corrosion resistant pins and methof of making
US5093282A (en) * 1988-04-13 1992-03-03 Kabushiki Kaisha Toshiba Method of making a semiconductor device having lead pins and a metal shell

Also Published As

Publication number Publication date
JPS6122864B2 (en) 1986-06-03

Similar Documents

Publication Publication Date Title
JPS6457738A (en) Package for semiconductor device
JPS55136979A (en) Digital watch with curved surface
JPS56101761A (en) Airtight package for integrated circuit
TW356622B (en) Piezoelectric element package in which a piezoelectric element on a chip carrier is reliably shielded by using a cap
JPS53112061A (en) Wiring substrate of semiconductor chip
JPS5387192A (en) Production of crystal vibrator
JPS55166941A (en) Semiconductor device
JPS5623755A (en) Assembly of semiconductor device
JPS57143847A (en) Air-tight sealed package
JPS54146986A (en) Package for semiconductor device
JPS5768088A (en) Photosemiconductor device
JPS6451707A (en) Manufacture of surface acoustic wave chip device
JPS6489356A (en) Hybrid integrated circuit
JPS646562A (en) Airtight sealing
JPS5487183A (en) Package for semiconductor device
JPS57196612A (en) Airtight package for quartz oscillator
JPS54155768A (en) Manufacture of semiconductor device
JPS5621349A (en) Package for integrated circuit
JPS5656656A (en) Container for semiconductor device
JPS57148362A (en) Semiconductor device
JPS5650548A (en) Manufacture of semiconductor device
JPS5734349A (en) Semiconductor device
JPS5739557A (en) Semiconductor device
JPS5796555A (en) Metallic cap for semiconductor and manufacture thereof
JPS5366393A (en) Manufacture of crystal oscillator