JPS5656656A - Container for semiconductor device - Google Patents

Container for semiconductor device

Info

Publication number
JPS5656656A
JPS5656656A JP13312179A JP13312179A JPS5656656A JP S5656656 A JPS5656656 A JP S5656656A JP 13312179 A JP13312179 A JP 13312179A JP 13312179 A JP13312179 A JP 13312179A JP S5656656 A JPS5656656 A JP S5656656A
Authority
JP
Japan
Prior art keywords
glass piece
cap
peripheral edge
fitted
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13312179A
Other languages
Japanese (ja)
Inventor
Katsuhiko Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13312179A priority Critical patent/JPS5656656A/en
Publication of JPS5656656A publication Critical patent/JPS5656656A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Abstract

PURPOSE:To eliminate the local tensile stress to a glass piece by a method wherein the surface of the peripheral edge of the opening of the container whereon the glass piece is bonded is formed to be a vertical cylindrical surface in relation to a welded surface when a metal cap fitted with the ultraviolet-ray transmitting glass piece is sealed by seam welding to the opening part. CONSTITUTION:At the outer-peripheral edge of a ceramic substrate 1 having a concave mount part 3 are provided a W metallized pattern 5 connected with an outside lead 6 and a bonding pad 4 situated inside the former, and to this mount part 3 is fixed an IC element 2, while electrodes provided on the element 2 are connected with the pad 4 by using fine metal wires 9. Next, a seal frame 8 is fixed on the outer-peripheral edge of the substrate 1 by using a brazing material 7, while the metal cap 17b is fitted inside the opening and sealed. On said occasion, the construction of the cap 17b is made as follows: the main body of the cap 17b is prepared by the ultraviolet-ray transmitting glass piece 13b and the peripheral side surface 15b thereof is set vertical and fitted to the frame 8 opposed thereto through seal welding by using the 1st and the 2nd metallic drawn pieces 12b and 19b.
JP13312179A 1979-10-16 1979-10-16 Container for semiconductor device Pending JPS5656656A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13312179A JPS5656656A (en) 1979-10-16 1979-10-16 Container for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13312179A JPS5656656A (en) 1979-10-16 1979-10-16 Container for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5656656A true JPS5656656A (en) 1981-05-18

Family

ID=15097274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13312179A Pending JPS5656656A (en) 1979-10-16 1979-10-16 Container for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5656656A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894853B2 (en) * 2002-05-10 2005-05-17 Texas Instruments Incorporated Stress relieved frame
US7994638B2 (en) 2007-05-11 2011-08-09 Panasonic Corporation Semiconductor chip and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894853B2 (en) * 2002-05-10 2005-05-17 Texas Instruments Incorporated Stress relieved frame
US7402458B2 (en) 2002-05-10 2008-07-22 Texas Instruments Incorporated Stress relieved flat frame for DMD window
US7994638B2 (en) 2007-05-11 2011-08-09 Panasonic Corporation Semiconductor chip and semiconductor device

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