JPS5617048A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5617048A
JPS5617048A JP9360079A JP9360079A JPS5617048A JP S5617048 A JPS5617048 A JP S5617048A JP 9360079 A JP9360079 A JP 9360079A JP 9360079 A JP9360079 A JP 9360079A JP S5617048 A JPS5617048 A JP S5617048A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor device
alloy
electric characteristics
improve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9360079A
Other languages
Japanese (ja)
Inventor
Hideo Sakane
Hiroshi Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP9360079A priority Critical patent/JPS5617048A/en
Publication of JPS5617048A publication Critical patent/JPS5617048A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent deterioration of electric characteristics of a semiconductor device and to improve the quality thereof by forming Ni-Sn alloy film on the surface of a body of a lead frame thereof. CONSTITUTION:An alloy containing 40-80% by weight of Sn and the rest of Ni is plated on the surface of the body of a lead frame. This configuration can solder and adhere with resin at the time of die bonding. Further, Au-Sn eutectic alloy can be formed between the Au wires for bonding therebetween. Since Ni is contained in the Sn, the characteristics of the Sn in utilized to improve solderability thereof and to eliminate migration like Ag and whisker of Sn with the result of no apprehension of deteriorating its electric characteristics.
JP9360079A 1979-07-20 1979-07-20 Lead frame for semiconductor device Pending JPS5617048A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9360079A JPS5617048A (en) 1979-07-20 1979-07-20 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9360079A JPS5617048A (en) 1979-07-20 1979-07-20 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5617048A true JPS5617048A (en) 1981-02-18

Family

ID=14086802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9360079A Pending JPS5617048A (en) 1979-07-20 1979-07-20 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5617048A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121746U (en) * 1985-01-16 1986-07-31
EP0926735A2 (en) * 1997-12-25 1999-06-30 Japan Solderless Terminal Mfg. Co., Ltd. Tin-nickel alloy and component surface-treated with alloy
US8013428B2 (en) 2004-09-28 2011-09-06 Lsi Corporation Whisker-free lead frames
US9136244B2 (en) 2011-12-21 2015-09-15 Hitachi, Ltd. Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61121746U (en) * 1985-01-16 1986-07-31
EP0926735A2 (en) * 1997-12-25 1999-06-30 Japan Solderless Terminal Mfg. Co., Ltd. Tin-nickel alloy and component surface-treated with alloy
EP0926735A3 (en) * 1997-12-25 2002-04-17 Japan Solderless Terminal Mfg. Co., Ltd. Tin-nickel alloy and component surface-treated with alloy
US8013428B2 (en) 2004-09-28 2011-09-06 Lsi Corporation Whisker-free lead frames
US9136244B2 (en) 2011-12-21 2015-09-15 Hitachi, Ltd. Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film

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