JPS56169338A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS56169338A
JPS56169338A JP7140080A JP7140080A JPS56169338A JP S56169338 A JPS56169338 A JP S56169338A JP 7140080 A JP7140080 A JP 7140080A JP 7140080 A JP7140080 A JP 7140080A JP S56169338 A JPS56169338 A JP S56169338A
Authority
JP
Japan
Prior art keywords
silver
lead
boundary
longitudinal slots
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7140080A
Other languages
Japanese (ja)
Inventor
Toshinori Yoshizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7140080A priority Critical patent/JPS56169338A/en
Publication of JPS56169338A publication Critical patent/JPS56169338A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the silver migration of a semiconductor device by forming longitudinal slots of the ticknesswise direction of a lead at the silver plating boundary of the lead, thereby preventing the advance of plating solution exceeding the boundary. CONSTITUTION:A lead frame is plated with silver 20 by dipping the inner lead part 12 in a silver plating solution, and is preferably bonded respectively to the tab and the lead 12 of a pellet and a wire. Longitudinal slots 22 of the thicknesswise direction of the lead frame are formed on the side surface 21 of the lead at the position corresponding to the boundary A of the silver plated part 20. Thus, the range of the silver plated part 20 can be effectively limited to the inner side from the longitudinal slots 22, and the silver plated part 20 is completely concealed, when it is packaged in the later step, within the package, but is not exhibited out of the package. Accordingly, the silver migration can be securely prevented.
JP7140080A 1980-05-30 1980-05-30 Semiconductor device Pending JPS56169338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7140080A JPS56169338A (en) 1980-05-30 1980-05-30 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7140080A JPS56169338A (en) 1980-05-30 1980-05-30 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS56169338A true JPS56169338A (en) 1981-12-26

Family

ID=13459421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7140080A Pending JPS56169338A (en) 1980-05-30 1980-05-30 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS56169338A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169457A (en) * 1986-01-22 1987-07-25 Hitachi Micro Comput Eng Ltd Lead frame for semiconductor device
JPS62202546A (en) * 1986-02-28 1987-09-07 Shinko Electric Ind Co Ltd Lead frame
US5633205A (en) * 1994-08-11 1997-05-27 Shinko Electric Industries Co., Ltd. Lead frame and process of producing such a frame

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62169457A (en) * 1986-01-22 1987-07-25 Hitachi Micro Comput Eng Ltd Lead frame for semiconductor device
JPS62202546A (en) * 1986-02-28 1987-09-07 Shinko Electric Ind Co Ltd Lead frame
US5633205A (en) * 1994-08-11 1997-05-27 Shinko Electric Industries Co., Ltd. Lead frame and process of producing such a frame

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