JPS62202546A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS62202546A
JPS62202546A JP4436786A JP4436786A JPS62202546A JP S62202546 A JPS62202546 A JP S62202546A JP 4436786 A JP4436786 A JP 4436786A JP 4436786 A JP4436786 A JP 4436786A JP S62202546 A JPS62202546 A JP S62202546A
Authority
JP
Japan
Prior art keywords
inner lead
plating
mold resin
metal
outside
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4436786A
Other languages
Japanese (ja)
Inventor
Yoshio Amari
甘利　喜雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP4436786A priority Critical patent/JPS62202546A/en
Publication of JPS62202546A publication Critical patent/JPS62202546A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the squeeze-out of a plating metal by providing a means of preventing the squeeze-out of the partially plated metal outside of a mold resin on the side of part covered with the mold resin of an inner lead. CONSTITUTION:A V-shaped groove 3 is provided on the side 1a of an inner lead 1. The V-shape grove 3 prevents the external squeeze-out of a plating liquid when partial plating is carried out even if the upper and the lower surfaces of the inner lead 1 are held by a mask and a plating metal 2 is not adhered to the outside from the V-shape groove. Accordingly, the plating metal 2 is not squeezed out toward the outside of a mold resin.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体チップと外部端子等を電気的に接続する
リードフレームに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead frame for electrically connecting a semiconductor chip and external terminals.

〔従来技１術とその問題点〕 一般に、樹脂封止型半導体装置に用いられるリードフレ
ームは、そのインナーリードとステージ上に搭載された
半導体チップはワイヤボンディングにより接続される。[Prior art 1 and its problems] Generally, in a lead frame used for a resin-sealed semiconductor device, its inner leads and a semiconductor chip mounted on a stage are connected by wire bonding.

その後、インナーリード、半導体チップおよびステージ
は樹脂モールドによって被覆して一体的に形成される。Thereafter, the inner leads, semiconductor chip, and stage are covered with a resin mold and integrally formed.

この樹脂モールドされるインナーリードのワイヤボンデ
ィングする部分には銀、金等の部分めっきが施される。The wire bonding portions of the resin-molded inner leads are selectively plated with silver, gold, or the like.

この部分めっきは、第３図に示寸ように、インナーリー
ド１の部分めっきを施す部分（同図斜線ＰＩＳ）より外
側から、ゴム板等の弾性体からなるマスク（図示せず）
によってインナーリード１を上下より挟持してシールし
ながら行なわれる。This partial plating is carried out using a mask (not shown) made of an elastic material such as a rubber plate from the outside of the portion of the inner lead 1 to be partially plated (diagonal line PIS in the figure) as shown in FIG.
This is done while sandwiching and sealing the inner lead 1 from above and below.

ところが、インナーリード１の側面１ａは弾性体のマス
クによって挟持して−ｂ完全にシールすることは困難な
ため、めっき金属２が同図斜線に示すようにマスクによ
る挟持部分へはみ出して被着してしまう。However, since it is difficult to completely seal the side surface 1a of the inner lead 1 by sandwiching it with an elastic mask, the plated metal 2 protrudes and adheres to the portion sandwiched by the mask, as shown by the diagonal lines in the figure. I end up.

このめつぎ金属２のはみ出しを防止するためには、イン
ナーリード１の側面１ａ部分もマスクによってシールす
ればよいのであるが、インナーリード１の厚さがあるた
めマスクによる挟持部分の側面１ａを完全にシールする
ことは国難である。In order to prevent the protrusion of the mating metal 2, it is sufficient to seal the side surface 1a of the inner lead 1 with a mask, but due to the thickness of the inner lead 1, the side surface 1a of the portion held by the mask must be completely sealed. It is a national disaster to put a seal on the country.

一方、最近は半導体装置の小形化、高密度化により、イ
ンナーリードの部分のめつき領域と樹脂モールド領域が
極めて接近して設けられることがレフ、このため樹脂モ
ールドを施した場合に、そ：ワモールド樹脂ライン４外
にまでめっき金属２がはみ出してしまう。このはみ出し
ためつき金属２上に外装めっきが付着すると、外装めっ
きのはがれを誘発する。また、隣接するインナーリード
の間隔が小さい場合、比較的大電流を流したり、湿気の
多い雰囲気中に用いられていると、モールド樹脂からは
み出した隣接するめつき金属２が相Ｈに導通し、特にめ
っき金属が銀である場合にはシルバーマイグレーション
が発生するどいつ不都合があった。On the other hand, as semiconductor devices have recently become smaller and more dense, the plating area of the inner lead portion and the resin mold area have become extremely close to each other. The plated metal 2 protrudes to the outside of the Wamold resin line 4. If the exterior plating adheres to this protruding plating metal 2, it will cause the exterior plating to peel off. In addition, when the distance between adjacent inner leads is small, when a relatively large current is applied, or when used in a humid atmosphere, the adjacent plated metal 2 protruding from the molding resin may become conductive to phase H, especially When the plating metal is silver, there is a problem in that silver migration occurs.

（発明の目的） 本発明はこれらの点に鑑みでなされたものであり、固型
な構成により、めっき金属がインナーリードの側面を樹
脂モールド部より外方へはみ比重ことを確実に防止する
ことができるため、シルバーマイグレーション笠の不都
合を解消させろことができ、更にモールド樹脂の食い付
ぎ性も向上させることのできるリードフレームを提供す
ることを目的とする。(Object of the Invention) The present invention has been made in view of these points, and the solid structure reliably prevents the plating metal from extending outward from the resin molded part of the side surface of the inner lead. It is an object of the present invention to provide a lead frame which can eliminate the inconveniences of silver migration caps and also improve the bite of mold resin.

〔発明の概要〕[Summary of the invention]

本発明のリードフレームは、インナーリードのモールド
樹脂によって被覆される部分の側面に、部分めっき金属
がモールド樹脂の外方へはみ出すことを防止するはみ出
し防止手段を設けたことを特徴とする。The lead frame of the present invention is characterized in that a protrusion prevention means for preventing the partially plated metal from protruding outside the mold resin is provided on the side surface of the portion of the inner lead covered with the mold resin.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例を第１図および第２図について説
明する。Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

第１図は本発明の一実施例を示す。本実施例においては
、インナーリード１の側面１ａに同図斜線で示すめっき
金属２の外方へのはみ出しを防止するはみ出し防止手段
として縦方向のＶ溝３を多数並設している。FIG. 1 shows an embodiment of the invention. In this embodiment, a large number of vertical V-grooves 3 are arranged in parallel on the side surface 1a of the inner lead 1 as extrusion prevention means for preventing the plated metal 2 shown by diagonal lines in the figure from extruding outward.

第２図は本発明の他の実施例を示し、１個の大きなＶ溝
３を設けたものである。FIG. 2 shows another embodiment of the invention, in which one large V-groove 3 is provided.

このようにＶ　％　３を設けると、部分めっきを施す際
に、インナーリード１の上下面をマスクによって挟持し
ていても、■満３がめつき液の外方へ句はみ出しを遮断
するので、めっき金属２は■溝晧部分より外方へは被着
しない。従って、モールド樹脂の外側にめっき金属２が
はみ出すことも無くなり、従来のように隣接するインナ
ーリード１同志の間にシルバーマイグレーション笠の電
気導通を起すことがない。また、めっき金属２のはみ出
しが防止されるため部分めっきを施す領域ら設計通りに
精度よく実現することができる。また、■溝３はモール
ド樹脂とインナーリード１との食い（Ｊき性を向上させ
、インナーリード１が−し−ルド樹脂から扱は出すこと
を確実に防止することができる。By providing V % 3 in this way, even if the upper and lower surfaces of the inner lead 1 are sandwiched between masks when performing partial plating, the V % 3 prevents the plating solution from protruding outward, so that the plating can be prevented. Metal 2 does not adhere outward from the groove part. Therefore, the plating metal 2 does not protrude to the outside of the molded resin, and electrical conduction of the silver migration cap does not occur between adjacent inner leads 1 as in the conventional case. In addition, since the plating metal 2 is prevented from protruding, the area to which partial plating is applied can be precisely realized as designed. Furthermore, the groove 3 improves the friction between the mold resin and the inner lead 1, and can reliably prevent the inner lead 1 from coming out of the mold resin.

なお、はみ出し防止手段として、前記各実施例において
は■溝３を設けたが、溝の形状はどのようなものでもよ
い。また、溝の代りに突条をインナーリード１の側面１
ａに突設するようにしても全く同様に機能する。Incidentally, as a protrusion prevention means, in each of the above embodiments, a groove 3 is provided, but the groove may have any shape. Also, instead of a groove, a protrusion is provided on the side surface 1 of the inner lead 1.
Even if it is provided protrudingly from a, it functions in exactly the same way.

（発明の効果〕 このように本発明のリードフレームは構成され作用する
ものであるから、ｎ　事な構成により、インナーリード
のめつき金属が−［−ルド樹脂の外方球はみ出すことを
確実に防止することができ、シルバーマイグレーション
等の発生がなくなり更にモールド樹脂の食い付き性も向
上させることができる等の効果を秦する。(Effects of the Invention) Since the lead frame of the present invention is constructed and operates as described above, the unique structure ensures that the plating metal of the inner lead protrudes from the outer sphere of the -[-]ld resin. It is possible to prevent the occurrence of silver migration, etc., and furthermore, it is possible to improve the bite of the mold resin.

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図はそれぞれ本発明のリードフレーム
の実施例を示す斜視図、第３図は従来例を示す斜視図で
ある。 １・・・インナーリード、１ａ・・・側面、２・・・め
っき金属、３・・・Ｖ溝、４・・・モールド樹脂ライン
。1 and 2 are perspective views showing an embodiment of the lead frame of the present invention, and FIG. 3 is a perspective view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Inner lead, 1a... Side surface, 2... Plated metal, 3... V groove, 4... Mold resin line.

Claims (1)

【特許請求の範囲】 １）インナーリードのモールド樹脂によって被覆される
部分の側面に、部分めっき金属が該モールド樹脂の外方
へはみ出すことを防止するはみ出し防止手段を設けたこ
とを特徴とするリードフレーム。 ２）はみ出し防止手段は、インナーリードの側面に形成
した溝からなることを特徴とする特許請求の範囲第１項
記載のリードフレーム。 ３）はみ出し防止手段は、インナーリードの側面に形成
した突条からなることを特徴とする特許請求の範囲第１
項記載のリードフレーム。[Scope of Claims] 1) A lead characterized in that an extrusion prevention means for preventing partially plated metal from extruding outside of the mold resin is provided on the side surface of the portion of the inner lead covered with the mold resin. flame. 2) The lead frame according to claim 1, wherein the extrusion prevention means comprises a groove formed on a side surface of the inner lead. 3) Claim 1, wherein the extrusion prevention means consists of a protrusion formed on the side surface of the inner lead.
Lead frame as described in section.
JP4436786A 1986-02-28 1986-02-28 Lead frame Pending JPS62202546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4436786A JPS62202546A (en) 1986-02-28 1986-02-28 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4436786A JPS62202546A (en) 1986-02-28 1986-02-28 Lead frame

Publications (1)

Publication Number Publication Date
JPS62202546A true JPS62202546A (en) 1987-09-07

Family

ID=12689540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4436786A Pending JPS62202546A (en) 1986-02-28 1986-02-28 Lead frame

Country Status (1)

Country Link
JP (1) JPS62202546A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2284886A3 (en) * 2009-06-17 2013-02-27 LSI Corporation Lead frame design to improve reliability

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169338A (en) * 1980-05-30 1981-12-26 Hitachi Ltd Semiconductor device
JPS62169457A (en) * 1986-01-22 1987-07-25 Hitachi Micro Comput Eng Ltd Lead frame for semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56169338A (en) * 1980-05-30 1981-12-26 Hitachi Ltd Semiconductor device
JPS62169457A (en) * 1986-01-22 1987-07-25 Hitachi Micro Comput Eng Ltd Lead frame for semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2284886A3 (en) * 2009-06-17 2013-02-27 LSI Corporation Lead frame design to improve reliability
US8869389B2 (en) 2009-06-17 2014-10-28 Lsi Corporation Method of manufacturing an electronic device package

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