JPS5735358A - Lead frame and semiconductor device using said frame - Google Patents

Lead frame and semiconductor device using said frame

Info

Publication number
JPS5735358A
JPS5735358A JP11020180A JP11020180A JPS5735358A JP S5735358 A JPS5735358 A JP S5735358A JP 11020180 A JP11020180 A JP 11020180A JP 11020180 A JP11020180 A JP 11020180A JP S5735358 A JPS5735358 A JP S5735358A
Authority
JP
Japan
Prior art keywords
tab
hanging
lead
frame
base part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11020180A
Other languages
Japanese (ja)
Inventor
Kazumasa Yamamoto
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11020180A priority Critical patent/JPS5735358A/en
Publication of JPS5735358A publication Critical patent/JPS5735358A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent the inclination of a tab, and to prevent tab shorts, poor bonding, pellet cracking, and the like by making the base part of a tab hanging lead thicker than the tip of the lead, and hanging the tab by said thick part. CONSTITUTION:Two tab hanging leads 20 are used on both sides of the central part of the longitudinal direction of the tab 16. The base part of each tab hanging lead 20 is thicker than the tip side thereof, i.e., the tab side. The position of said tab hanging lead 20 shown by the chain line 24, i.e., the thick base part, is used to hang the tab. Since the mechanical strength of the tab hanging position 24 is strong, the tab hanging is stably performed, and the inclination of the tab 16 can be prevented.
JP11020180A 1980-08-13 1980-08-13 Lead frame and semiconductor device using said frame Pending JPS5735358A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11020180A JPS5735358A (en) 1980-08-13 1980-08-13 Lead frame and semiconductor device using said frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11020180A JPS5735358A (en) 1980-08-13 1980-08-13 Lead frame and semiconductor device using said frame

Publications (1)

Publication Number Publication Date
JPS5735358A true JPS5735358A (en) 1982-02-25

Family

ID=14529605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11020180A Pending JPS5735358A (en) 1980-08-13 1980-08-13 Lead frame and semiconductor device using said frame

Country Status (1)

Country Link
JP (1) JPS5735358A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055647A (en) * 1983-09-07 1985-03-30 Nec Corp Semiconductor device
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS60141147U (en) * 1984-02-28 1985-09-18 新日本無線株式会社 lead frame
JPS61156756A (en) * 1984-12-27 1986-07-16 Toshiba Corp Lead frame for semiconductor device
JPS61159045A (en) * 1984-12-27 1986-07-18 Toshiba Corp Air-conditioning equipment
JPS61166054A (en) * 1985-01-18 1986-07-26 Hitachi Ltd Semiconductor device
JPS6473752A (en) * 1987-09-16 1989-03-20 Nec Corp Lead frame

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127565A (en) * 1974-03-27 1975-10-07
JPS5391577A (en) * 1977-01-21 1978-08-11 Mitsubishi Electric Corp Manufacture of semiconductor device of resinsealing type

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50127565A (en) * 1974-03-27 1975-10-07
JPS5391577A (en) * 1977-01-21 1978-08-11 Mitsubishi Electric Corp Manufacture of semiconductor device of resinsealing type

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6055647A (en) * 1983-09-07 1985-03-30 Nec Corp Semiconductor device
JPS6080262A (en) * 1983-10-07 1985-05-08 Nec Corp Semiconductor device
JPS60141147U (en) * 1984-02-28 1985-09-18 新日本無線株式会社 lead frame
JPS61156756A (en) * 1984-12-27 1986-07-16 Toshiba Corp Lead frame for semiconductor device
JPS61159045A (en) * 1984-12-27 1986-07-18 Toshiba Corp Air-conditioning equipment
JPS61166054A (en) * 1985-01-18 1986-07-26 Hitachi Ltd Semiconductor device
JPS6473752A (en) * 1987-09-16 1989-03-20 Nec Corp Lead frame

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