JPS57120352A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57120352A
JPS57120352A JP56006598A JP659881A JPS57120352A JP S57120352 A JPS57120352 A JP S57120352A JP 56006598 A JP56006598 A JP 56006598A JP 659881 A JP659881 A JP 659881A JP S57120352 A JPS57120352 A JP S57120352A
Authority
JP
Japan
Prior art keywords
lead
metal
bump
bonding
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56006598A
Other languages
Japanese (ja)
Inventor
Kazuo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RIKOO TOKEI KK
Ricoh Elemex Corp
Original Assignee
RIKOO TOKEI KK
Ricoh Elemex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RIKOO TOKEI KK, Ricoh Elemex Corp filed Critical RIKOO TOKEI KK
Priority to JP56006598A priority Critical patent/JPS57120352A/en
Publication of JPS57120352A publication Critical patent/JPS57120352A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To effectively and rigidly bond the lead of an external circuit to a bump at the bonding time by flattening the top recess of the bump with the same metal as bonding metal plated on the lead. CONSTITUTION:A metal 7 plated on the lead 6 of an external circuit is adhered to the recess at the center of a bump 1 so that the recess becomes flat. In this manner, the contact with the lead 8 becomes large at the time of bonding with the lead 8, and the lead 8 is contacted widely with the same metal 7 adhered to the bump 1 as the metal placed on the lead. Accordingly, the diffusion of the pressure applied at the bonding time is accelerated to prevent the mechanical damage due to the load pressure applied to the semiconductor device. Further, the lead 8 can be effectively and rigidly bonded by the ready solid diffusion of the plating metal to the adhering metal to the bump 1.
JP56006598A 1981-01-19 1981-01-19 Semiconductor device Pending JPS57120352A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56006598A JPS57120352A (en) 1981-01-19 1981-01-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56006598A JPS57120352A (en) 1981-01-19 1981-01-19 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57120352A true JPS57120352A (en) 1982-07-27

Family

ID=11642763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56006598A Pending JPS57120352A (en) 1981-01-19 1981-01-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57120352A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575449A (en) * 1993-10-13 1996-11-19 Tachi-S Co., Ltd. Slide rail device for seat
US6879027B2 (en) * 2000-11-30 2005-04-12 Kabushiki Kaisha Shinkawa Semiconductor device having bumps

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5575449A (en) * 1993-10-13 1996-11-19 Tachi-S Co., Ltd. Slide rail device for seat
US6879027B2 (en) * 2000-11-30 2005-04-12 Kabushiki Kaisha Shinkawa Semiconductor device having bumps

Similar Documents

Publication Publication Date Title
MY105130A (en) Self-centering electrode for power devices.
JPS57120352A (en) Semiconductor device
JPS648647A (en) Manufacture of semiconductor device
JPS55140238A (en) Tape carrier type semiconductor device
JPS5772336A (en) Semiconductor device
JPS6459947A (en) Semiconductor device
JPS5240973A (en) Method of connecting semiconductor devices
JPS5785244A (en) Semiconductor device
JPS57103342A (en) Semiconductor device
JPS5740943A (en) Semiconductror device
JPS5788741A (en) Semiconductor device
JPS5617048A (en) Lead frame for semiconductor device
JPS5762550A (en) Semiconductor device
GB1275343A (en) Improvements relating to lead frames for use with semiconductor devices
JPS5756938A (en) Semiconductor device
JPS5752158A (en) Composite semiconductor device
GB1017423A (en) Improvements in semiconductor devices
JPS57176750A (en) Cooler for electronic device
JPS5624964A (en) Semiconductor device
JPS5739547A (en) Semiconductor device
JPS5818947A (en) Lead frame
JPS5275979A (en) Semiconductor device
JPS57176752A (en) Brazing material and semiconductor device using the same
JPS647626A (en) Semiconductor device
JPS57114248A (en) Semiconductor device