JPS5624964A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5624964A
JPS5624964A JP10198879A JP10198879A JPS5624964A JP S5624964 A JPS5624964 A JP S5624964A JP 10198879 A JP10198879 A JP 10198879A JP 10198879 A JP10198879 A JP 10198879A JP S5624964 A JPS5624964 A JP S5624964A
Authority
JP
Japan
Prior art keywords
pellet
diode
confronting
solder
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10198879A
Other languages
Japanese (ja)
Inventor
Masanori Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10198879A priority Critical patent/JPS5624964A/en
Publication of JPS5624964A publication Critical patent/JPS5624964A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To suppress stress applied to a semiconductor pellet at the time of soldering it and to prevent the damage of the pellet by forming a projection corresponding to the terminal confronting the main surface of the pellet and forming a flat portion at the end confronting the back surface of the pellet. CONSTITUTION:An external terminal 11 soldered to the back surface 1b of a glass coated diode 1 is formed in flat shape on the confronting portion, and is uniformly adhered with solder 12. When the solder is accordingly solidified, no unreasonable stress is applied to the diode. Thus, the pellet is not broken, no crack is generated on the glass portion, and the diode is not deteriorated.
JP10198879A 1979-08-08 1979-08-08 Semiconductor device Pending JPS5624964A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10198879A JPS5624964A (en) 1979-08-08 1979-08-08 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10198879A JPS5624964A (en) 1979-08-08 1979-08-08 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5624964A true JPS5624964A (en) 1981-03-10

Family

ID=14315212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10198879A Pending JPS5624964A (en) 1979-08-08 1979-08-08 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5624964A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129136U (en) * 1984-02-03 1985-08-30 新電元工業株式会社 semiconductor equipment
JP2011142360A (en) * 2011-04-22 2011-07-21 Renesas Electronics Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129136U (en) * 1984-02-03 1985-08-30 新電元工業株式会社 semiconductor equipment
JPH0219971Y2 (en) * 1984-02-03 1990-05-31
JP2011142360A (en) * 2011-04-22 2011-07-21 Renesas Electronics Corp Semiconductor device

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