JPS5447478A - Substrate for mounting circuit element - Google Patents

Substrate for mounting circuit element

Info

Publication number
JPS5447478A
JPS5447478A JP11269677A JP11269677A JPS5447478A JP S5447478 A JPS5447478 A JP S5447478A JP 11269677 A JP11269677 A JP 11269677A JP 11269677 A JP11269677 A JP 11269677A JP S5447478 A JPS5447478 A JP S5447478A
Authority
JP
Japan
Prior art keywords
flange
header
external force
heat sink
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11269677A
Other languages
Japanese (ja)
Other versions
JPS603782B2 (en
Inventor
Atsushi Sasayama
Akio Yasukawa
Sueo Kawai
Mitsuo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11269677A priority Critical patent/JPS603782B2/en
Publication of JPS5447478A publication Critical patent/JPS5447478A/en
Publication of JPS603782B2 publication Critical patent/JPS603782B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE:To prevent damaging of circuit elements and prevent degradation in characteristics owing to bending deformation of header at the time of contacting flange to flat face. CONSTITUTION:A heat sink 10 of barrel is fitted to the center of a flat flange 9 such as of iron-Ni-base alloy or other and is then caulked to form a header 11. The flange 9 is thinner than the heat shink 10 and is provided with a thin-deformation part 13 in the fitting part 12. Hence, when external force is exerted to circumferential edge of the flange, stress concentrates in the portion 13 and absorbs the external force and therefore bending hardly occurs in the central heat sink 10. Because of this, the pellet does no damage and degrade in its characteristics.
JP11269677A 1977-09-21 1977-09-21 Circuit element mounting board Expired JPS603782B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11269677A JPS603782B2 (en) 1977-09-21 1977-09-21 Circuit element mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11269677A JPS603782B2 (en) 1977-09-21 1977-09-21 Circuit element mounting board

Publications (2)

Publication Number Publication Date
JPS5447478A true JPS5447478A (en) 1979-04-14
JPS603782B2 JPS603782B2 (en) 1985-01-30

Family

ID=14593193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11269677A Expired JPS603782B2 (en) 1977-09-21 1977-09-21 Circuit element mounting board

Country Status (1)

Country Link
JP (1) JPS603782B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134960A (en) * 1985-03-01 1986-02-19 Toshiba Component Kk Manufacture of stem for semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115137336A (en) 2017-02-28 2022-10-04 松下知识产权经营株式会社 Processing method, system and storage medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6134960A (en) * 1985-03-01 1986-02-19 Toshiba Component Kk Manufacture of stem for semiconductor device
JPH0122741B2 (en) * 1985-03-01 1989-04-27 Toshiba Components

Also Published As

Publication number Publication date
JPS603782B2 (en) 1985-01-30

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