JPS5224467A - Mounting method of electric element - Google Patents

Mounting method of electric element

Info

Publication number
JPS5224467A
JPS5224467A JP10095375A JP10095375A JPS5224467A JP S5224467 A JPS5224467 A JP S5224467A JP 10095375 A JP10095375 A JP 10095375A JP 10095375 A JP10095375 A JP 10095375A JP S5224467 A JPS5224467 A JP S5224467A
Authority
JP
Japan
Prior art keywords
mounting method
electric element
doides
soldering
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10095375A
Other languages
Japanese (ja)
Inventor
Yoshirou Yokota
Tamotsu Yoshitomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP10095375A priority Critical patent/JPS5224467A/en
Publication of JPS5224467A publication Critical patent/JPS5224467A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

PURPOSE:When soldering Tr, doides and other electric devices on lead frame headers and other device mounting materials, the solder layer is formed quickly on required surface section and with less solder consumption.
JP10095375A 1975-08-20 1975-08-20 Mounting method of electric element Pending JPS5224467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10095375A JPS5224467A (en) 1975-08-20 1975-08-20 Mounting method of electric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10095375A JPS5224467A (en) 1975-08-20 1975-08-20 Mounting method of electric element

Publications (1)

Publication Number Publication Date
JPS5224467A true JPS5224467A (en) 1977-02-23

Family

ID=14287708

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10095375A Pending JPS5224467A (en) 1975-08-20 1975-08-20 Mounting method of electric element

Country Status (1)

Country Link
JP (1) JPS5224467A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149042A (en) * 1983-02-15 1984-08-25 Hitachi Cable Ltd Lead frame for semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59149042A (en) * 1983-02-15 1984-08-25 Hitachi Cable Ltd Lead frame for semiconductor

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