JPS60129136U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60129136U
JPS60129136U JP1984014852U JP1485284U JPS60129136U JP S60129136 U JPS60129136 U JP S60129136U JP 1984014852 U JP1984014852 U JP 1984014852U JP 1485284 U JP1485284 U JP 1485284U JP S60129136 U JPS60129136 U JP S60129136U
Authority
JP
Japan
Prior art keywords
semiconductor element
utility
model registration
semiconductor device
connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1984014852U
Other languages
Japanese (ja)
Other versions
JPH0219971Y2 (en
Inventor
岡村　富雄
横山　武光
Original Assignee
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新電元工業株式会社 filed Critical 新電元工業株式会社
Priority to JP1984014852U priority Critical patent/JPS60129136U/en
Publication of JPS60129136U publication Critical patent/JPS60129136U/en
Application granted granted Critical
Publication of JPH0219971Y2 publication Critical patent/JPH0219971Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/8434—Bonding interfaces of the connector
    • H01L2224/84345—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/84801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

、第１図、第２図は従来構造図及びその説明図、第３図
、第４図は本考案の一実施例構造図であ図において１は
ベース電極（板）、ｌａは取付孔、−１ｂ−Ｉ　Ｃｔ　
　ｌｄは外部リード線、２は半導体素子、２ａｙ２ｂは
半田、３は接続板、３’ａｔ３ｂは突起部、４′は半田
、５は外部リード線、６　−はモールド樹種である。　
　　　　゛　、　　−・−１, FIGS. 1 and 2 are conventional structural diagrams and their explanatory diagrams, and FIGS. 3 and 4 are structural diagrams of one embodiment of the present invention. In the figures, 1 is a base electrode (plate), la is a mounting hole, -1b-I Ct
ld is an external lead wire, 2 is a semiconductor element, 2ay2b is solder, 3 is a connection plate, 3'at3b is a protrusion, 4' is solder, 5 is an external lead wire, and 6- is a molding material.
゛ , −・−1

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）ベース電極と、前記ベース電極上に一方の電極部
が接着された半導体素子と、前記半導体素子の他方の型
部と外部リード線との２点間を夫々半田接続する接続板
を有する半導体装置において、前記外部り、−ド線及び
接続板の夫々接続面の少くとも一方に突起部を設けたこ
とを特゛　　　徴とする半導体装置。(1) It has a base electrode, a semiconductor element with one electrode part adhered to the base electrode, and a connecting plate that connects two points of the other mold part of the semiconductor element and an external lead wire by soldering, respectively. A semiconductor device, characterized in that a protrusion is provided on at least one of the connection surfaces of the external wire, the negative wire, and the connection plate. （２）　　半導体素子と外部リード線が高低関係に配設
置　　　されたことを特徴とする実用新案登録請求の範
囲第（１）項記載の半導体装置。　　　　゛（３）接続
板０半導体素子との接続面番°突起部章設けたことを特
徴とする実用新案登録請求の範囲　−□第（１）項及び
第（２）項記載の半導体装置。　　　　、(2) The semiconductor device according to claim (1) of the utility model registration, characterized in that the semiconductor element and the external lead wire are arranged in a height relationship.゛(3) Scope of Utility Model Registration Claims characterized in that a connecting plate 0 is provided with a protruding surface number for connection with a semiconductor element - □ The semiconductor device according to paragraphs (1) and (2). ,
JP1984014852U 1984-02-03 1984-02-03 semiconductor equipment Granted JPS60129136U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984014852U JPS60129136U (en) 1984-02-03 1984-02-03 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984014852U JPS60129136U (en) 1984-02-03 1984-02-03 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS60129136U true JPS60129136U (en) 1985-08-30
JPH0219971Y2 JPH0219971Y2 (en) 1990-05-31

Family

ID=30500155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984014852U Granted JPS60129136U (en) 1984-02-03 1984-02-03 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60129136U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176930U (en) * 1988-06-06 1989-12-18
JP2011198929A (en) * 2010-03-18 2011-10-06 Shindengen Electric Mfg Co Ltd Internal connection structure of semiconductor device and semiconductor device
JP5701377B2 (en) * 2011-03-24 2015-04-15 三菱電機株式会社 Power semiconductor module and power unit device
WO2018021322A1 (en) * 2016-07-26 2018-02-01 三菱電機株式会社 Semiconductor device
EP3584831A4 (en) * 2017-02-20 2020-08-19 Shindengen Electric Manufacturing Co., Ltd. Electronic device, and connector

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512728A (en) * 1978-07-14 1980-01-29 Hitachi Ltd Regin sealing type power transistor
JPS5624964A (en) * 1979-08-08 1981-03-10 Mitsubishi Electric Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512728A (en) * 1978-07-14 1980-01-29 Hitachi Ltd Regin sealing type power transistor
JPS5624964A (en) * 1979-08-08 1981-03-10 Mitsubishi Electric Corp Semiconductor device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01176930U (en) * 1988-06-06 1989-12-18
JP2011198929A (en) * 2010-03-18 2011-10-06 Shindengen Electric Mfg Co Ltd Internal connection structure of semiconductor device and semiconductor device
JP5701377B2 (en) * 2011-03-24 2015-04-15 三菱電機株式会社 Power semiconductor module and power unit device
US9129931B2 (en) 2011-03-24 2015-09-08 Mitsubishi Electric Corporation Power semiconductor module and power unit device
WO2018021322A1 (en) * 2016-07-26 2018-02-01 三菱電機株式会社 Semiconductor device
JPWO2018021322A1 (en) * 2016-07-26 2019-03-14 三菱電機株式会社 Semiconductor device
EP3584831A4 (en) * 2017-02-20 2020-08-19 Shindengen Electric Manufacturing Co., Ltd. Electronic device, and connector
US10896868B2 (en) 2017-02-20 2021-01-19 Shindengen Electric Manufacturing Co., Ltd. Electronic device and connector

Also Published As

Publication number Publication date
JPH0219971Y2 (en) 1990-05-31

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