JPH01176930U - - Google Patents

Info

Publication number
JPH01176930U
JPH01176930U JP1988074299U JP7429988U JPH01176930U JP H01176930 U JPH01176930 U JP H01176930U JP 1988074299 U JP1988074299 U JP 1988074299U JP 7429988 U JP7429988 U JP 7429988U JP H01176930 U JPH01176930 U JP H01176930U
Authority
JP
Japan
Prior art keywords
semiconductor chip
connector
semiconductor device
semiconductor
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988074299U
Other languages
Japanese (ja)
Other versions
JP2528687Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988074299U priority Critical patent/JP2528687Y2/en
Publication of JPH01176930U publication Critical patent/JPH01176930U/ja
Application granted granted Critical
Publication of JP2528687Y2 publication Critical patent/JP2528687Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L24/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4007—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/4005—Shape
    • H01L2224/4009—Loop shape
    • H01L2224/40095—Kinked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/40247—Connecting the strap to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は半導体チツプの断面構造図、第２図は
従来の外部引出電極構造の説明図、第３図および
第４図は本考案の一実施例の説明図、第５図は本
考案の他の実施例の説明図である。 １…半導体チツプ、２…シリコン基板、３，３
′…表面不活性膜、４，４′…薄膜金属電極、５
，５′…半田、６…第１リードフレーム、６ａ…
接続部、７…接続子、７ａ…接続部、８…第２リ
ードフレーム、９…半田接続部、１０…樹脂封止
、１１，１２…接続突部。 Fig. 1 is a cross-sectional structural diagram of a semiconductor chip, Fig. 2 is an explanatory diagram of a conventional external extraction electrode structure, Figs. 3 and 4 are explanatory diagrams of an embodiment of the present invention, and Fig. 5 is an explanatory diagram of an embodiment of the present invention. It is an explanatory view of another example. 1... Semiconductor chip, 2... Silicon substrate, 3, 3
'...Surface inactive film, 4,4'...Thin film metal electrode, 5
, 5'...Solder, 6...First lead frame, 6a...
Connection part, 7... Connector, 7a... Connection part, 8... Second lead frame, 9... Solder connection part, 10... Resin sealing, 11, 12... Connection protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプと外部接続用の接続子を含んだ樹
脂外装の半導体装置において、第１接続子と第２
接続子のそれぞれに前記半導体チツプの四角形電
極とほぼ同じ大きさと形状をもつ平らな面の接続
突部をもたせて半導体チツプの各電極と半田付け
接続することを特徴とする半導体装置。 In a resin-clad semiconductor device that includes a semiconductor chip and a connector for external connection, a first connector and a second
A semiconductor device characterized in that each of the connectors has a connecting protrusion on a flat surface having approximately the same size and shape as the rectangular electrodes of the semiconductor chip, and is connected to each electrode of the semiconductor chip by soldering.
JP1988074299U 1988-06-06 1988-06-06 Planar type 2-terminal bidirectional thyristor Expired - Lifetime JP2528687Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988074299U JP2528687Y2 (en) 1988-06-06 1988-06-06 Planar type 2-terminal bidirectional thyristor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988074299U JP2528687Y2 (en) 1988-06-06 1988-06-06 Planar type 2-terminal bidirectional thyristor

Publications (2)

Publication Number Publication Date
JPH01176930U true JPH01176930U (en) 1989-12-18
JP2528687Y2 JP2528687Y2 (en) 1997-03-12

Family

ID=31299415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988074299U Expired - Lifetime JP2528687Y2 (en) 1988-06-06 1988-06-06 Planar type 2-terminal bidirectional thyristor

Country Status (1)

Country Link
JP (1) JP2528687Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5246766A (en) * 1975-10-09 1977-04-13 Mitsubishi Electric Corp Semiconductor device
JPS56110652U (en) * 1980-01-28 1981-08-27
JPS60129136U (en) * 1984-02-03 1985-08-30 新電元工業株式会社 semiconductor equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5246766A (en) * 1975-10-09 1977-04-13 Mitsubishi Electric Corp Semiconductor device
JPS56110652U (en) * 1980-01-28 1981-08-27
JPS60129136U (en) * 1984-02-03 1985-08-30 新電元工業株式会社 semiconductor equipment

Also Published As

Publication number Publication date
JP2528687Y2 (en) 1997-03-12

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