JPH01120334U - - Google Patents
Info
- Publication number
- JPH01120334U JPH01120334U JP1452088U JP1452088U JPH01120334U JP H01120334 U JPH01120334 U JP H01120334U JP 1452088 U JP1452088 U JP 1452088U JP 1452088 U JP1452088 U JP 1452088U JP H01120334 U JPH01120334 U JP H01120334U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor device
- convex portion
- conductive paste
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図は本考案の半導体装置実装構造の第１の
実施例を示す断面図、第２図は本考案の実装構造
における基板を示す平面図、第３図は本考案の実
装構造における第２の実施例を示す断面図、第４
図ａから第４図ｄまでは、本考案の実装構造を得
るための一製造法を示す断面図、第５図ａ，ｂ，
ｃは従来例における実装構造を示す説明図である
。
１…基板、２…ＩＣ、３…入出力電極、４…凸
部、５…貫通穴、６…下面、７…導電性ペースト
、８…下面電極、９…封止樹脂、１０…上面。
FIG. 1 is a sectional view showing a first embodiment of the semiconductor device mounting structure of the present invention, FIG. 2 is a plan view showing a substrate in the mounting structure of the present invention, and FIG. A cross-sectional view showing an embodiment of the fourth embodiment.
Figures a to 4d are cross-sectional views showing one manufacturing method for obtaining the mounting structure of the present invention, and Figures 5a, b,
c is an explanatory diagram showing a mounting structure in a conventional example. DESCRIPTION OF SYMBOLS 1... Substrate, 2... IC, 3... Input/output electrode, 4... Convex part, 5... Through hole, 6... Bottom surface, 7... Conductive paste, 8... Bottom electrode, 9... Sealing resin, 10... Top surface.
Claims (1)
グして樹脂封止する半導体装置の実装構造におい
て、前記基板は前記半導体装置の入出力電極に対
応する前記基板の一方の側に設ける凸部と、該凸
部に対応する貫通穴と、前記凸部から前記貫通穴
を介して前記基板の他方の側まで設ける導電性ペ
ーストとを有し、前記基板の他方の側に設ける前
記導電性ペーストを下面電極とすることを特徴と
する半導体装置の実装構造。 In a semiconductor device mounting structure in which a semiconductor device is face-down bonded to a substrate and sealed with resin, the substrate has a convex portion provided on one side of the substrate corresponding to the input/output electrodes of the semiconductor device, and a convex portion provided on the convex portion. The conductive paste has a corresponding through hole and a conductive paste provided from the convex portion to the other side of the substrate via the through hole, and the conductive paste provided on the other side of the substrate is used as a bottom electrode. A mounting structure for a semiconductor device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1452088U JPH01120334U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1452088U JPH01120334U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120334U true JPH01120334U (en) | 1989-08-15 |
Family
ID=31225786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1452088U Pending JPH01120334U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120334U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011183489A (en) * | 2010-03-05 | 2011-09-22 | Fujitsu Ltd | Screw fastening driver, screw fastening device and method |
-
1988
- 1988-02-05 JP JP1452088U patent/JPH01120334U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011183489A (en) * | 2010-03-05 | 2011-09-22 | Fujitsu Ltd | Screw fastening driver, screw fastening device and method |
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