JPH02140850U - - Google Patents
Info
- Publication number
- JPH02140850U JPH02140850U JP4881889U JP4881889U JPH02140850U JP H02140850 U JPH02140850 U JP H02140850U JP 4881889 U JP4881889 U JP 4881889U JP 4881889 U JP4881889 U JP 4881889U JP H02140850 U JPH02140850 U JP H02140850U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- electrodes
- protruding electrodes
- bonded
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図及び第２図は、本考案の一実施例を示し
、第１図ａは、突起及び突起電極が形成されたＬ
ＳＩチツプの平面図、第１図ｂは、バンプ面を封
止した状態を示す平面図、第２図は半導体素子に
封止剤を転写する際の状態を示す側断面図、第３
図は、従来の半導体素子を示す図である。
１０……ＬＳＩチツプ、１１……バンプ電極、
１２〜２１……突起、２２……封止剤、２６……
フインガリード。
FIGS. 1 and 2 show an embodiment of the present invention, and FIG.
FIG. 1B is a plan view of the SI chip, FIG. 1B is a plan view showing a state in which the bump surface is sealed, FIG.
The figure is a diagram showing a conventional semiconductor element. 10...LSI chip, 11...bump electrode,
12-21...Protrusion, 22...Sealant, 26...
Fingarid.
Claims (1)
数の突起電極をリード端子に接合し、この接合部
分を封止剤で封止する半導体素子において、 隣接する前記突起電極が離れる前記一面の隅部
及び側縁部に突起を設けたことを特徴とする半導
体素子。[Claims for Utility Model Registration] In a semiconductor device that has a large number of protruding electrodes on the periphery of one surface, these protruding electrodes are bonded to lead terminals, and this bonded portion is sealed with a sealant, in which adjacent A semiconductor device characterized in that projections are provided at corners and side edges of the one surface from which the projection electrodes are separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4881889U JPH02140850U (en) | 1989-04-27 | 1989-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4881889U JPH02140850U (en) | 1989-04-27 | 1989-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140850U true JPH02140850U (en) | 1990-11-26 |
Family
ID=31565969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4881889U Pending JPH02140850U (en) | 1989-04-27 | 1989-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140850U (en) |
-
1989
- 1989-04-27 JP JP4881889U patent/JPH02140850U/ja active Pending
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