JPS6112245U

JPS6112245U - semiconductor equipment

Info

Publication number: JPS6112245U
Application number: JP9704284U
Authority: JP
Inventors: 彰阪上; 英司高井
Original assignee: 株式会社東芝; 東芝マイコンエンジニアリング株式会社
Priority date: 1984-06-28
Filing date: 1984-06-28
Publication date: 1986-01-24

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案の一実施例に係る半導体装置の断面図、
第２図は同装置のパッケージ本体の裏面図、第３図は同
装置のソケットの平面図、第４図は同装置のその他のソ
ケットの平面図、第５図は本考案に係るソケットの凸部
の変形例を示す断面図、第６図は従来の半導体装置の平
面図、第７図は同装置のパッケージ本体の平面図、第８
図ａは同パッケージ本体の上蓋と下蓋の合せブレを説明
するための正面図、同図ｂは同パッケージ本体の上蓋と
下蓋を一体化した状態を説明するための正面図、第９図
ａは従来の他の半導体装置の平面図、同図ｂは同装置を
部分的に拡大した平面図である。１１・・・ソケット、１２・・・開口部、１３ａ〜１３
ｃ，２１，２３・・・凸部（第１の嵌合部）、１４・・
・コンタクトピン、１５・・・パッケージ本体、１６ａ
〜１６ｃ・・・凹部（第２の嵌合部）、１７・・・アウ
ターリード。FIG. 1 is a cross-sectional view of a semiconductor device according to an embodiment of the present invention;
Fig. 2 is a back view of the package body of the device, Fig. 3 is a plan view of the socket of the device, Fig. 4 is a plan view of other sockets of the device, and Fig. 5 is the protrusion of the socket according to the present invention. 6 is a plan view of a conventional semiconductor device, FIG. 7 is a plan view of the package body of the same device, and FIG.
Figure a is a front view to explain how the upper and lower lids of the package body fit together, Figure b is a front view to explain the state in which the upper and lower covers of the package body are integrated, and Figure 9 FIG. 1A is a plan view of another conventional semiconductor device, and FIG. 1B is a partially enlarged plan view of the same device. 11... Socket, 12... Opening, 13a-13
c, 21, 23... Convex portion (first fitting portion), 14...
・Contact pin, 15...Package body, 16a
~16c... Recessed part (second fitting part), 17... Outer lead.

Claims

[Scope of utility model registration request]

It comprises a socket and a package body that is attached to the socket and has a semiconductor element mounted therein, and a plurality of first fitting portions are provided on the upper surface of the socket to which the package body is to be attached so that the fitting portions are asymmetrical. A semiconductor device characterized in that a plurality of second fitting portions are provided on the lower surface of the package body at positions corresponding to the fitting portions and fitting with the fitting portions.