JPS5827939U

JPS5827939U - Ceramic package

Info

Publication number: JPS5827939U
Application number: JP12197281U
Authority: JP
Inventors: 森本　幹夫; 相馬　廣治
Original assignee: 日本電気株式会社
Priority date: 1981-08-18
Filing date: 1981-08-18
Publication date: 1983-02-23

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図ａ、　　ｂおよび第２図は従来のセラミックパッ
ケージを示す図、第３図ａおよびｂはそれぞれ本考案の
一実施例を示す平面図および断面図ならびに第４図ａお
よびｂはそれぞれ他の実施例を示す平面図および断面図
である。図において、１・・・・・・キャップ、２・・・・・・
エンボス加工部、３・・・・・・実装された素子、４・
・・・・・ウェルドリング部、５・・・・・・セラミッ
クケース、６・・・・・・結線、７・・・・・・キャッ
プ、８・・・・・・セラミックケース、９・・・・・・
キャップ、１０，１１．１２，１３・・・・・・エンボ
ス加工部、１４・・・・・・ウェルドリング部、１５・
・・・・・セラミックケース、１６・・・・・・実装さ
れた素子、１７・・・・・・キャップ、１８．１９・・
・用エンボス加工部。FIGS. 1a, b and 2 are views showing a conventional ceramic package, FIGS. 3a and b are a plan view and a cross-sectional view, respectively, showing an embodiment of the present invention, and FIGS. 4a and b are views showing another example, respectively. FIG. 2 is a plan view and a sectional view showing an example of the invention. In the figure, 1... Cap, 2...
Embossed part, 3...Mounted element, 4.
...Weld ring part, 5 ... Ceramic case, 6 ... Connection, 7 ... Cap, 8 ... Ceramic case, 9 ...・・・・・・
Cap, 10, 11. 12, 13... Embossed part, 14... Weld ring part, 15.
... Ceramic case, 16 ... Mounted element, 17 ... Cap, 18.19 ...
- Embossed part.

Claims

[Scope of utility model registration request]

It is composed of a ceramic case in which an integrated circuit element is mounted, a metal ring provided on the ceramic case, and a cap that covers the upper part of the ceramic case and has a plurality of protrusions that engage with the metal ring. A ceramic package featuring