JPS5952697U - packaging tape - Google Patents

packaging tape

Info

Publication number
JPS5952697U
JPS5952697U JP14788582U JP14788582U JPS5952697U JP S5952697 U JPS5952697 U JP S5952697U JP 14788582 U JP14788582 U JP 14788582U JP 14788582 U JP14788582 U JP 14788582U JP S5952697 U JPS5952697 U JP S5952697U
Authority
JP
Japan
Prior art keywords
packaging tape
semiconductor device
abstract
concave portion
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14788582U
Other languages
Japanese (ja)
Inventor
敏明 小林
Original Assignee
山形日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山形日本電気株式会社 filed Critical 山形日本電気株式会社
Priority to JP14788582U priority Critical patent/JPS5952697U/en
Publication of JPS5952697U publication Critical patent/JPS5952697U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａは従来の包装用テープを説明するための平面図
、第１図Ｂは従来の包装用テープの断面を示す断面図、
第２図は従来の包装用テープの欠点を説明するための平
面図、第３図は本考案の実施例の包装用テープの平面図
、第４図は第３図においてａ−ａ’線に沿って切断し矢
印の方向から見た断面図である。尚図において、 １・・・半導体装置、２．３・・・リード、４．４′・
・・包装用テープ、５・・・凸部、６・・・底面、７・
・・凹部。FIG. 1A is a plan view for explaining a conventional packaging tape, FIG. 1B is a sectional view showing a cross section of a conventional packaging tape,
Fig. 2 is a plan view for explaining the drawbacks of conventional packaging tape, Fig. 3 is a plan view of a packaging tape according to an embodiment of the present invention, and Fig. 4 is taken along line a-a' in Fig. 3. FIG. In the figure, 1... semiconductor device, 2.3... lead, 4.4'.
...Packaging tape, 5...Protrusion, 6...Bottom surface, 7.
・Concavity.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置を収納するための凹部を備えた包装用テープ
において、前記半導体装置の移動を制限するための凸部
を前記凹部の底面に設けたことを特徴とする包装用テー
プ。What is claimed is: 1. A packaging tape having a concave portion for accommodating a semiconductor device, characterized in that a convex portion for restricting movement of the semiconductor device is provided on the bottom surface of the concave portion.
JP14788582U 1982-09-29 1982-09-29 packaging tape Pending JPS5952697U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14788582U JPS5952697U (en) 1982-09-29 1982-09-29 packaging tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14788582U JPS5952697U (en) 1982-09-29 1982-09-29 packaging tape

Publications (1)

Publication Number Publication Date
JPS5952697U true JPS5952697U (en) 1984-04-06

Family

ID=30328739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14788582U Pending JPS5952697U (en) 1982-09-29 1982-09-29 packaging tape

Country Status (1)

Country Link
JP (1) JPS5952697U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113998A (en) * 1983-11-26 1985-06-20 松下電器産業株式会社 Electronic part assembly
JPH0299771U (en) * 1988-09-09 1990-08-08

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113998A (en) * 1983-11-26 1985-06-20 松下電器産業株式会社 Electronic part assembly
JPH0299771U (en) * 1988-09-09 1990-08-08

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