JPS6015856U - Tape for packaging electronic parts - Google Patents

Tape for packaging electronic parts

Info

Publication number
JPS6015856U
JPS6015856U JP10834183U JP10834183U JPS6015856U JP S6015856 U JPS6015856 U JP S6015856U JP 10834183 U JP10834183 U JP 10834183U JP 10834183 U JP10834183 U JP 10834183U JP S6015856 U JPS6015856 U JP S6015856U
Authority
JP
Japan
Prior art keywords
tape
electronic parts
packaging electronic
accommodating portion
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10834183U
Other languages
Japanese (ja)
Other versions
JPH0327992Y2 (en
Inventor
敏明 小林
Original Assignee
山形日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山形日本電気株式会社 filed Critical 山形日本電気株式会社
Priority to JP10834183U priority Critical patent/JPS6015856U/en
Publication of JPS6015856U publication Critical patent/JPS6015856U/en
Application granted granted Critical
Publication of JPH0327992Y2 publication Critical patent/JPH0327992Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packages (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の包装用テープの一例の断面図、第２図ａ
、　　ｂは第１図に示す包装用テープに半導体装置を収
容した時の二つの状態を示す平面図、第３図、第４図、
第５図は本考案包装用テープの一実施例のものに半導体
装置を収容したものの平面図、そのａ−ａ’断面図、ｂ
−ｂ’断面図、第６図、第７図は本考案包装用テープの
他実施例のもの〜に半導体装置を収容したものの断面図
である。 １・・・・・・半導体装置、２，３・・・・・・リード
、４，４′・・・・・・包装用テープ、５・・・・・・
装置収納凹部、６・・・・・・底面、７・・・・・・側
面、８・・・・・・側面凹部。Figure 1 is a sectional view of an example of a conventional packaging tape, Figure 2a
, b are plan views showing two states when the semiconductor device is housed in the packaging tape shown in FIG. 1, FIGS. 3 and 4,
FIG. 5 is a plan view of one embodiment of the packaging tape of the present invention in which a semiconductor device is housed, its a-a' cross-sectional view, and b
-b' sectional view, FIGS. 6 and 7 are sectional views of other embodiments of the packaging tape of the present invention in which a semiconductor device is housed. 1... Semiconductor device, 2, 3... Lead, 4, 4'... Packaging tape, 5...
Device storage recess, 6...bottom, 7...side, 8...side recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 可撓性テープの電子部品を収納する個所に凹部収容部を
備え、該凹部収容部に前記電子部品の移動を制限するた
めの突出部を設けたことを特徴とする電子部品包装用テ
ープ。1. A tape for packaging electronic components, characterized in that a flexible tape is provided with a concave accommodating portion at a location where an electronic component is to be accommodated, and a protrusion for restricting movement of the electronic component is provided in the concave accommodating portion.
JP10834183U 1983-07-13 1983-07-13 Tape for packaging electronic parts Granted JPS6015856U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10834183U JPS6015856U (en) 1983-07-13 1983-07-13 Tape for packaging electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10834183U JPS6015856U (en) 1983-07-13 1983-07-13 Tape for packaging electronic parts

Publications (2)

Publication Number Publication Date
JPS6015856U true JPS6015856U (en) 1985-02-02
JPH0327992Y2 JPH0327992Y2 (en) 1991-06-17

Family

ID=30252803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10834183U Granted JPS6015856U (en) 1983-07-13 1983-07-13 Tape for packaging electronic parts

Country Status (1)

Country Link
JP (1) JPS6015856U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58203858A (en) * 1982-05-14 1983-11-28 株式会社日立製作所 Tape-shaped package of article

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58203858A (en) * 1982-05-14 1983-11-28 株式会社日立製作所 Tape-shaped package of article

Also Published As

Publication number Publication date
JPH0327992Y2 (en) 1991-06-17

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