JPS59169047U - integrated circuit elements - Google Patents

integrated circuit elements

Info

Publication number
JPS59169047U
JPS59169047U JP6412283U JP6412283U JPS59169047U JP S59169047 U JPS59169047 U JP S59169047U JP 6412283 U JP6412283 U JP 6412283U JP 6412283 U JP6412283 U JP 6412283U JP S59169047 U JPS59169047 U JP S59169047U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit elements
package
magazine
projections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6412283U
Other languages
Japanese (ja)
Other versions
JPS638137Y2 (en
Inventor
永守　浩
村地　伸一郎
Original Assignee
大電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 大電株式会社 filed Critical 大電株式会社
Priority to JP6412283U priority Critical patent/JPS59169047U/en
Publication of JPS59169047U publication Critical patent/JPS59169047U/en
Application granted granted Critical
Publication of JPS638137Y2 publication Critical patent/JPS638137Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例の構造を示す図、第２図はマガジンの構
造の例を示す斜視図、第３図は本考案の第１実施例を示
す図、第４図は第２実施例を示す図、第５図は第３実施
例を示す図である。 １：パッケージ、２：突起、３：突条、４：突条。Fig. 1 is a diagram showing the structure of a conventional example, Fig. 2 is a perspective view showing an example of the magazine structure, Fig. 3 is a diagram showing the first embodiment of the present invention, and Fig. 4 is a diagram showing the second embodiment. The figure shown in FIG. 5 is a diagram showing a third embodiment. 1: package, 2: protrusion, 3: protrusion, 4: protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージ底面に、集積回路素子用マガジンの支持面に
点又は線接触させるための突起又は突条を設けたことを
特徴とする集積回路素子。1. An integrated circuit device, characterized in that the bottom surface of the package is provided with projections or protrusions for making point or line contact with the support surface of a magazine for integrated circuit devices.
JP6412283U 1983-04-28 1983-04-28 integrated circuit elements Granted JPS59169047U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6412283U JPS59169047U (en) 1983-04-28 1983-04-28 integrated circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6412283U JPS59169047U (en) 1983-04-28 1983-04-28 integrated circuit elements

Publications (2)

Publication Number Publication Date
JPS59169047U true JPS59169047U (en) 1984-11-12
JPS638137Y2 JPS638137Y2 (en) 1988-03-10

Family

ID=30194306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6412283U Granted JPS59169047U (en) 1983-04-28 1983-04-28 integrated circuit elements

Country Status (1)

Country Link
JP (1) JPS59169047U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152157A (en) * 1986-12-16 1988-06-24 Toyota Motor Corp Ic package for plastic resin coating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49106276U (en) * 1972-12-28 1974-09-11
JPS54124680A (en) * 1978-03-20 1979-09-27 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49106276U (en) * 1972-12-28 1974-09-11
JPS54124680A (en) * 1978-03-20 1979-09-27 Nec Corp Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63152157A (en) * 1986-12-16 1988-06-24 Toyota Motor Corp Ic package for plastic resin coating

Also Published As

Publication number Publication date
JPS638137Y2 (en) 1988-03-10

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