JPS638137Y2 - - Google Patents
Info
- Publication number
- JPS638137Y2 JPS638137Y2 JP1983064122U JP6412283U JPS638137Y2 JP S638137 Y2 JPS638137 Y2 JP S638137Y2 JP 1983064122 U JP1983064122 U JP 1983064122U JP 6412283 U JP6412283 U JP 6412283U JP S638137 Y2 JPS638137 Y2 JP S638137Y2
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- package
- integrated circuit
- support surface
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、集積回路素子収納又は供給用マガジ
ンに対して円滑に取り出しを可能にした集積回路
素子に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to an integrated circuit device that can be smoothly taken out from a magazine for storing or supplying integrated circuit devices.
従来の集積回路素子用パツケージは第１図（ａ
は平面図、ｂは側面図、ｃは正面図）に示すよう
に底面がフラツトな面であるので、通常使用され
ている第２図に示すようなマガジン（例えば実公
昭51−7012号公報記載のもの）に収納した場合、
マガジン１１における集積回路素子支持面１２と
パツケージ底面とは面接触状態となる。
A conventional integrated circuit device package is shown in Figure 1 (a).
As shown in Fig. 2 is a plan view, b is a side view, and c is a front view, the bottom surface is flat, so it cannot be used with a commonly used magazine as shown in Fig. 2 (for example, as described in Japanese Utility Model Publication No. 51-7012). When stored in
The integrated circuit element supporting surface 12 of the magazine 11 and the bottom surface of the package are in surface contact.
集積回路素子はきわめて軽量に形成されている
にもかかわらず、マガジンを傾斜させて収納、取
り出す場合、接触面積が広いと、集積回路素子が
マガジン内部で円滑に移動せず詰まつてしまうと
いう問題があり、特に集積回路素子の収納、取り
出し機構が自動化されている生産ラインに与える
影響は大きく、産業上大きな不利益となつてい
た。 Despite the fact that integrated circuit elements are extremely lightweight, when the magazine is tilted for storage or removal, if the contact area is large, the integrated circuit elements will not move smoothly inside the magazine and may become jammed. This has had a particularly large impact on production lines where the storage and removal mechanisms for integrated circuit elements are automated, creating a major industrial disadvantage.
工業的にこれらマガジンを製造する場合、マガ
ジン加工方向（長手方向）に完全な平面状態を維
持するのは困難であり、通常加工方向に凹凸が生
じる。また、合成樹脂製マガジンの場合、成形加
工条件の微妙な変化で加工方向の凹凸以外に表面
の円滑度が変化したり、加工条件によつては加工
歪が残り、マガジン使用中に徐々に変形してしま
う場合がある。 When manufacturing these magazines industrially, it is difficult to maintain a perfect flat state in the magazine processing direction (longitudinal direction), and unevenness usually occurs in the processing direction. In addition, in the case of synthetic resin magazines, subtle changes in the molding processing conditions may cause changes in surface smoothness in addition to unevenness in the processing direction, and depending on the processing conditions, processing distortion may remain, resulting in gradual deformation during magazine use. You may end up doing this.
特に、帯電防止剤及び導電性塗料を合成樹脂製
マガジンに塗布するタイプのものでは、更に表面
塗布剤の塗布むらなどにより表面状態の不均一性
が加わる。 Particularly, in the case of a type in which an antistatic agent and a conductive paint are applied to a synthetic resin magazine, non-uniformity of the surface condition is added due to uneven application of the surface coating agent.
従つて、工業的規模で生産使用されているマガ
ジンの場合、集積回路素子とマガジンとの接触面
積に比例した摩擦力以外にマガジンの集積回路素
子支持面の幾何学的凹凸、表面の円滑度、マガジ
ンの変形、表面の不均一性などが相乗され、マガ
ジン内の集積回路素子の円滑な移動を妨げてしま
う。 Therefore, in the case of magazines that are produced and used on an industrial scale, in addition to the frictional force that is proportional to the contact area between the integrated circuit elements and the magazine, there are also effects on the geometric unevenness of the integrated circuit element supporting surface of the magazine, the surface smoothness, Deformation of the magazine, non-uniformity of the surface, etc. combine to hinder smooth movement of integrated circuit elements within the magazine.
このような問題に対し、パツケージ底面に突起
を設けることが実開昭49−106276号公報、特開昭
54−124680号公報等において提案されている。こ
れは、マガジンに対してパツケージを点接触で支
持するようにすることによつて、摩擦及びそれに
起因する静電気の発生を抑制しようとするもので
ある。 To solve this problem, it is proposed to provide a protrusion on the bottom of the package cage, as disclosed in Japanese Utility Model Application Publication No. 49-106276,
It has been proposed in Publication No. 54-124680, etc. This is intended to suppress friction and the generation of static electricity caused by it by supporting the package in point contact with the magazine.
ところで、マガジンにおけるパツケージ支持面
の幅は、パツケージの両側のピン列の幅に対して
余裕をもつて狭く形成されている。このため、パ
ツケージの底面に突起を設けてマガジンに対して
点接触させる構成では、突起の一部がマガジンの
パツケージ支持面から離脱して傾き、移動抵抗が
増加し、円滑な移動が阻害されるという問題があ
つた。
Incidentally, the width of the package support surface of the magazine is narrower than the width of the pin rows on both sides of the package. For this reason, in a configuration in which a projection is provided on the bottom of the package cage and makes point contact with the magazine, a portion of the projection separates from the package support surface of the magazine and tilts, increasing movement resistance and hindering smooth movement. There was a problem.
本考案は、このような従来の問題点に鑑みて案
出されたものであり、マガジンにおける集積回路
素子の移動の円滑化を図ることのできるパツケー
ジ構造を有する集積回路素子を提供することを目
的とする。 The present invention was devised in view of these conventional problems, and an object of the present invention is to provide an integrated circuit device having a package structure that allows smooth movement of the integrated circuit device in a magazine. shall be.
この目的を達成するため、本考案の集積回路素
子は、集積回路素子用マガジンの支持面に接触す
るパツケージ底面に、該パツケージの長手方向の
端部に角部が指向する状態のＶ状部分を有する突
条を設けたことを特徴とする。
In order to achieve this object, the integrated circuit device of the present invention has a V-shaped portion on the bottom surface of the package that contacts the support surface of the magazine for integrated circuit devices, with the corner facing toward the longitudinal end of the package. It is characterized by having a ridge with a ridge.
以下、本考案を実施例に基いて説明する。 The present invention will be explained below based on examples.
第３図は、本考案の実施例を示すもので、ａは
底面図、ｂは側面図、ｃは正面図である。 FIG. 3 shows an embodiment of the present invention, in which a is a bottom view, b is a side view, and c is a front view.
この実施例では、パツケージ１の底面に、長手
方向に長い六角形状をなす断面Ｖ状の突条４を六
角形状に形成したものであり、両端のＶ状部分４
ａを有することを特徴としている。このような構
造としているために、パツケージ１の中心位置が
マガジンにおけるパツケージ支持面１２（第２図
参照）の中心位置からずれたとしても、Ｖ状部分
４ａが支持面１２と接触しているため、パツケー
ジ１が傾いて支持面１２に対して接触抵抗が増す
ということがない。また、Ｖ状部分４ａを形成し
ているため、マガジンの支持面に多少の凹凸があ
つたとしても、円滑な移動を行うことができる。 In this embodiment, a hexagonal protrusion 4 having a V-shaped cross section and a hexagonal shape long in the longitudinal direction is formed on the bottom surface of the package cage 1.
It is characterized by having a. Because of this structure, even if the center position of the package 1 deviates from the center position of the package support surface 12 (see Figure 2) in the magazine, the V-shaped portion 4a is in contact with the support surface 12. Therefore, the package 1 does not tilt and the contact resistance against the support surface 12 increases. Further, since the V-shaped portion 4a is formed, even if the support surface of the magazine has some irregularities, smooth movement can be performed.
上述したように本考案においては、集積回路素
子用マガジンの支持面に接触するパツケージ底面
に、該パツケージの長手方向の端部に角部が指向
する状態のＶ状部分を有する突条を設けている。
このため、集積回路素子底面とマガジンの支持面
とが線接触となつて接触面積の大幅な低減を図る
ことができ、さらにＶ状部分を形成していること
により、パツケージの位置がずれても、傾いて抵
抗が大きくなるということがない。したがつて、
集積回路素子はマガジン中を円滑に移動できる。
As described above, in the present invention, a protrusion having a V-shaped portion with a corner facing toward the longitudinal end of the package is provided on the bottom surface of the package that contacts the support surface of the magazine for integrated circuit elements. There is.
Therefore, the bottom surface of the integrated circuit element and the supporting surface of the magazine form a line contact, which greatly reduces the contact area.Furthermore, by forming the V-shaped part, even if the position of the package is shifted, the contact area can be significantly reduced. , the resistance will not increase due to tilting. Therefore,
Integrated circuit devices can be moved smoothly through the magazine.
第１図は従来例の構造を示す図、第２図はマガ
ジンの構造の例を示す斜視図、第３図は本考案の
実施例を示す図である。
１……パツケージ、２……突起、４……突条、
４ａ……Ｖ状部分。
FIG. 1 is a diagram showing the structure of a conventional example, FIG. 2 is a perspective view showing an example of the structure of a magazine, and FIG. 3 is a diagram showing an embodiment of the present invention. 1...Package, 2...Protrusion, 4...Protrusion,
4a...V-shaped part.
Claims (1)
ツケージ底面に、該パツケージの長手方向の端部
に角部が指向する状態のＶ状部分を有する突条を
設けたことを特徴とする集積回路素子。 1. An integrated circuit device, characterized in that a protrusion having a V-shaped portion with a corner facing toward the longitudinal end of the package is provided on the bottom surface of the package that contacts the support surface of a magazine for integrated circuit devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6412283U JPS59169047U (en) | 1983-04-28 | 1983-04-28 | integrated circuit elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6412283U JPS59169047U (en) | 1983-04-28 | 1983-04-28 | integrated circuit elements |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59169047U JPS59169047U (en) | 1984-11-12 |
| JPS638137Y2 true JPS638137Y2 (en) | 1988-03-10 |
Family
ID=30194306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6412283U Granted JPS59169047U (en) | 1983-04-28 | 1983-04-28 | integrated circuit elements |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59169047U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2595947B2 (en) * | 1986-12-16 | 1997-04-02 | トヨタ自動車株式会社 | IC package for plastic resin coating |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124680A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Semiconductor device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5238914Y2 (en) * | 1972-12-28 | 1977-09-03 |
-
1983
- 1983-04-28 JP JP6412283U patent/JPS59169047U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54124680A (en) * | 1978-03-20 | 1979-09-27 | Nec Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59169047U (en) | 1984-11-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5351836A (en) | Container for plate-like objects | |
| KR20010014840A (en) | Tray for semiconductor integrated circuit device | |
| JPS638137Y2 (en) | ||
| JP2014051355A (en) | Transfer device for commercial product | |
| US4697935A (en) | Crossed-roller retainer | |
| JPH0627032Y2 (en) | Video tape reel support spring | |
| JPH0217430Y2 (en) | ||
| JPS5836225U (en) | metal flat pallet | |
| US5950843A (en) | Device for preventing contacting of wafers in wafer cassette | |
| JPH04103653U (en) | Wafer frame cassette | |
| JP2717324B2 (en) | Linear guide device | |
| US5332172A (en) | Tapered reel pressure spring | |
| KR102652284B1 (en) | Hand for Transfer substrate | |
| JPH0447444Y2 (en) | ||
| JPH0636549Y2 (en) | Magnetic tape cassette | |
| JPS6317191Y2 (en) | ||
| JP3957017B2 (en) | Glass plate cassette | |
| JPS6129652Y2 (en) | ||
| JPH035106Y2 (en) | ||
| JP2004075346A (en) | Slide fork | |
| JPS62237744A (en) | Cassette containing ic substrate | |
| KR960008157Y1 (en) | Wafer cassette | |
| KR200212333Y1 (en) | Paper sheet of audio tape cassette | |
| JPS6314380Y2 (en) | ||
| JPS6132129U (en) | Robotic hand for bucket palletizing |