JP2592093Y2 - Circuit component manufacturing equipment - Google Patents
Circuit component manufacturing equipmentInfo
- Publication number
- JP2592093Y2 JP2592093Y2 JP1990128318U JP12831890U JP2592093Y2 JP 2592093 Y2 JP2592093 Y2 JP 2592093Y2 JP 1990128318 U JP1990128318 U JP 1990128318U JP 12831890 U JP12831890 U JP 12831890U JP 2592093 Y2 JP2592093 Y2 JP 2592093Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit component
- pressing
- main body
- lead
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】 産業上の利用分野 本考案は、傾斜を防止して配線基板に実装することが
できる回路部品の製造装置に関する。DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention relates to an apparatus for manufacturing a circuit component that can be mounted on a wiring board while preventing inclination.
従来の技術 第11図は従来から用いられている回路部品１を示す図
であり、第12図は前記回路部品１の側面図である。回路
部品１は本体２と本体２から本体２に対して平行に突出
しているリード3,4とから成る。配線基板５には、挿通
孔6a,6bが形成されており、前記リード3,4を挿通孔6a,6
bに対応する位置においてＬ字形に屈曲し、挿通孔6a,6b
に挿入することによつて回路部品１が配線基板５に配置
されている。このとき本体２のリード３が突出している
位置から配線基板５までの距離をH1、本体２のリード４
が突出している位置から配線基板５までの距離をH2とす
る。2. Description of the Related Art FIG. 11 is a diagram showing a circuit component 1 conventionally used, and FIG. 12 is a side view of the circuit component 1. The circuit component 1 includes a main body 2 and leads 3 and 4 projecting from the main body 2 in parallel to the main body 2. Insertion holes 6a and 6b are formed in the wiring board 5, and the leads 3 and 4 are inserted into the insertion holes 6a and 6b.
b at the position corresponding to b, and the insertion holes 6a, 6b
The circuit component 1 is arranged on the wiring board 5 by being inserted into the wiring board 5. At this time, the distance from the position where the lead 3 of the main body 2 protrudes to the wiring board 5 is H1, and the lead 4 of the main body 2 is
H2 is the distance from the position at which the LED protrudes to the wiring board 5.
本体２は基板５の上面5aに載置されている。回路部品
１が熱を発生する場合、本体２が基板５の上面5aに接触
しているため、発生した熱を逃がすことができず、回路
部品１が破損するおそれがある。The main body 2 is placed on the upper surface 5a of the substrate 5. When the circuit component 1 generates heat, since the main body 2 is in contact with the upper surface 5a of the substrate 5, the generated heat cannot be released and the circuit component 1 may be damaged.
また、回路部品１が矢符Ａ方向に傾き、距離H1と距離
H2とが等しくならない、回路部品１が矢符Ｂ方向に傾き
隣接する回路部品1bに接触するなどのおそれもある。回
路部品１が隣接する回路部品1bに接触すると、回路部品
1,1bが損傷を生じる、また少なくともいずれか一方の回
路部品1,1bが発熱する場合、発生した熱で他方が破損す
るおそれもある。また矢符Ｂ方向に回路部品１が傾くと
きに回路部品1,1bの配置位置を離さなければならないた
め配線基板が大形になるという問題がある。Also, the circuit component 1 is tilted in the direction of arrow A, and the distance H1 and the distance
H2 may not be equal, or the circuit component 1 may be inclined in the direction of arrow B and come into contact with the adjacent circuit component 1b. When the circuit component 1 contacts the adjacent circuit component 1b, the circuit component
If at least one of the circuit components 1, 1b generates heat, the other may be damaged by the generated heat. Further, when the circuit component 1 is inclined in the direction of arrow B, the circuit components 1 and 1b must be separated from each other, so that there is a problem that the wiring board becomes large.
第13図は第２の従来から用いられている回路部品1aを
示す図であり、第14図は第13図の切断面線XV−XVから見
た断面図である。回路部品1aの本体2aから突出している
本体2aと平行に形成された支持突起7a,7bを有するリー
ド3a,4aが配線基板5cに向けて屈曲され、配線基板5cに
形成されている挿通孔6c,6dに挿入され配置されてい
る。このとき支持突起7a,7bが挿入孔6c,6dに入らないた
め、本体2aは配線基板5cの上面5dと接触しないで配置さ
れる。このため回路部品1aが発熱を生じる場合、熱を発
散することができ、回路部品1a自身が発する熱による破
損を防ぐことができる。FIG. 13 is a diagram showing a second conventionally used circuit component 1a, and FIG. 14 is a cross-sectional view taken along the line XV-XV of FIG. Leads 3a, 4a having support projections 7a, 7b formed in parallel with the main body 2a projecting from the main body 2a of the circuit component 1a are bent toward the wiring board 5c, and the insertion holes 6c formed in the wiring board 5c. , 6d. At this time, since the support projections 7a and 7b do not enter the insertion holes 6c and 6d, the main body 2a is arranged without contacting the upper surface 5d of the wiring board 5c. Therefore, when the circuit component 1a generates heat, the heat can be dissipated, and damage due to the heat generated by the circuit component 1a itself can be prevented.
また支持突起7a,7bを本体2aに平行になるように設け
たため、第11図の矢符Ａ方向の傾斜を防ぐことができ、
本体2aを回路基板5cと平行に設置することができる。In addition, since the support projections 7a and 7b are provided so as to be parallel to the main body 2a, inclination in the direction of the arrow A in FIG. 11 can be prevented,
The main body 2a can be installed in parallel with the circuit board 5c.
考案が解決しようとする課題 リード3a,4aに形成した支持突起7a,7bは本体2aに対し
て平行に形成されているため、第12図に示される矢符Ｂ
方向への傾斜を防止することができない。このため隣接
する回路部品に接触することによつて回路部品が損傷を
生じたり、回路部品の発熱によつて接触する回路部品を
破損するなどの問題がある。Since the support projections 7a and 7b formed on the leads 3a and 4a are formed parallel to the main body 2a, the arrow B shown in FIG.
Inability to prevent tilting in the direction. For this reason, there is a problem that the circuit component is damaged by contact with the adjacent circuit component, or the contacted circuit component is damaged by heat generation of the circuit component.
また、支持突起7a,7bを形成するための装置がなく、
製造工程が複雑であるという問題がある。In addition, there is no device for forming the support protrusions 7a and 7b,
There is a problem that the manufacturing process is complicated.
本考案の目的は、回路基板上での傾斜を防止した回路
部品を簡単な工程で製造できる簡単な工程で製造できる
簡単な装置を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a simple apparatus which can manufacture a circuit component in which a tilt on a circuit board is prevented by a simple process.
課題を解決するための手段 本考案は、回路部品本体と、回路部品本体から突出す
る２本のリード部材とを備える回路部品のリード部材に
該回路部品本体と直交する方向に支持突起を形成する回
路部品の製造装置であって、 一方のリード部材の回路部品本体側および他方のリー
ド部材の反回路部品本体側に配置され、２本のリード部
材を押圧する前記回路部品本体と直交する方向に延びる
一対の第１押圧面を有する第１押圧部材と、 前記一方のリード部材の反回路部品本体側および前記
他方のリード部材の回路部品本体側に配置され、２本の
リード部材を押圧する前記回路部品本体と直交する方向
に延びる一対の第２押圧面を有する第２押圧部材とを含
み、 第１押圧部材および第２押圧部材で２本のリード部材
を押圧し、２本のリード部材の各押圧部分を前記第１押
圧面および前記第２押圧面に沿つて延展させ、支持突起
を設けるようにしたことを特徴とする回路部品製造装置
である。Means for Solving the Problems According to the present invention, a support protrusion is formed on a lead member of a circuit component including a circuit component body and two lead members protruding from the circuit component body in a direction orthogonal to the circuit component body. An apparatus for manufacturing a circuit component, comprising: a lead member arranged on a circuit component body side of one lead member and a counter circuit component body side of the other lead member, and in a direction orthogonal to the circuit component body pressing two lead members. A first pressing member having a pair of first pressing surfaces extending; and a first pressing member disposed on a counter circuit component main body side of the one lead member and a circuit component main body side of the other lead member, and pressing the two lead members. A second pressing member having a pair of second pressing surfaces extending in a direction orthogonal to the circuit component main body; and pressing the two lead members with the first pressing member and the second pressing member. A circuit component manufacturing apparatus, wherein each pressing portion extends along the first pressing surface and the second pressing surface to provide a support protrusion.
作用 本考案に従えば、回路部品製造装置は、２本のリード
部材に回路部品本体と直交する方向に支持突起を形成す
るものであって、第１押圧部材と第２押圧部材とから成
る。第１押圧部材は、一方のリード部材の回路部品本体
側および他方のリード部材の反回路部品本体側に配置さ
れ、２本のリード部材の一方側を押圧する一対の第１押
圧面を有し、第２押圧部材は一方のリード部材の反回路
部品本体側および他方のリード部材の回路部品本体側に
配置され、２本のリード部材の他方側を押圧する一対の
第２押圧面を有する。また各押圧面は、回路部品本体と
直交する方向に延び、２本のリード部材の押圧部分は、
一対の第１押圧面および一対の第２抑圧面に沿って延展
されるように押圧される。これによつて２本のリード部
材の押圧部分に、リード部材の突出位置に関して半径方
向と交差する方向に突出した支持突起を形成する。この
ように簡単な装置と工程とで支持突起を得ることができ
る。According to the present invention, the circuit component manufacturing apparatus forms a support projection on two lead members in a direction orthogonal to the circuit component body, and includes a first pressing member and a second pressing member. The first pressing member is disposed on the circuit component main body side of one of the lead members and on the opposite circuit component main body side of the other lead member, and has a pair of first pressing surfaces for pressing one side of the two lead members. The second pressing member is disposed on the counter circuit component main body side of one lead member and on the circuit component main body side of the other lead member, and has a pair of second pressing surfaces for pressing the other side of the two lead members. Each pressing surface extends in a direction orthogonal to the circuit component body, and the pressing portions of the two lead members are:
It is pressed so as to extend along the pair of first pressing surfaces and the pair of second suppressing surfaces. As a result, support projections projecting in the direction intersecting the radial direction with respect to the projecting positions of the lead members are formed on the pressing portions of the two lead members. As described above, the support protrusion can be obtained with a simple device and a simple process.
実施例 第１図は、本考案の装置によつて製造された回路部品
11を配線基板15に配置した斜視図であり、第２図は第１
図に示される回路部品11を配線基板15に配置した正面図
であり、第３図は第１図に示される回路部品11を配線基
板15に配置した側面図であり、第４図は第２図の切断面
線IV−IVから見た側断面図であり、第５図は第２図の切
断面線Ｖ−Ｖから見た底断面図であり、第６図は第２図
の切断面線VI−VIから見た側断面図である。FIG. 1 shows a circuit component manufactured by the apparatus of the present invention.
FIG. 2 is a perspective view in which 11 is arranged on a wiring board 15, and FIG.
FIG. 3 is a front view in which the circuit component 11 shown in FIG. 1 is arranged on a wiring board 15, FIG. 3 is a side view in which the circuit component 11 shown in FIG. 1 is arranged on the wiring board 15, and FIG. FIG. 5 is a side sectional view taken along section line IV-IV in FIG. 5, FIG. 5 is a bottom sectional view taken along section line VV in FIG. 2, and FIG. 6 is a section section in FIG. FIG. 6 is a side sectional view taken along line VI-VI.
回路部品11の本体12からリード13,14が突出してお
り、リード13,14は配線基板15に形成される挿通孔16a,1
6bに対応する位置で配線基板14に向けて屈曲されてお
り、さらにリードー13,14には配線基板15上に対応する
位置が平面となるように三角形に押圧された支持突起17
a,17bが本体12と直交する方向に形成され、リード13,14
を挿通孔16a,16bに挿入することによつて回路部品11が
装着されている。Leads 13 and 14 protrude from the main body 12 of the circuit component 11, and the leads 13 and 14 are inserted into through holes 16a and 1
6b is bent toward the wiring board 14 at a position corresponding to 6b, and the support protrusions 17 are pressed on the leads 13 and 14 in a triangular shape so that the corresponding position on the wiring board 15 becomes a plane.
a, 17b are formed in a direction orthogonal to the main body 12, and the leads 13, 14
Is inserted into the insertion holes 16a and 16b, whereby the circuit component 11 is mounted.
配線基板15はガラスから成るため、挿通孔16a,16bは
円筒形に形成されている。リード13,14に形成されてい
る支持突起17a,17bの配線基板15と接触する面を平面と
しているため、回路部品11は配線基板15上で安定であ
る。また、支持突起17a,17bは本体12に対して直交する
方向に形成されているため、回路部品11が第３図の矢符
Ｃ方向に傾斜することが防止されている。Since the wiring board 15 is made of glass, the insertion holes 16a and 16b are formed in a cylindrical shape. Since the surfaces of the support protrusions 17a and 17b formed on the leads 13 and 14 that come into contact with the wiring board 15 are flat, the circuit component 11 is stable on the wiring board 15. Further, since the support projections 17a and 17b are formed in a direction orthogonal to the main body 12, the circuit component 11 is prevented from being inclined in the direction of arrow C in FIG.
第７図は、本考案の装置によって製造された他の回路
部品11aを配線基板15に配置した側断面図である。前述
の実施例と同様な部材には同じ参照符を添付する。本実
施例においては、第１図から第６図に示される実施例に
おいて、支持突起17a,17bの形状が異なつている。本実
施例の支持突起13cの形状は略半円形であり、配線基板1
5と接触する面は平面である。したがって前述の実施例
と同様の効果が得られる。FIG. 7 is a side sectional view in which another circuit component 11a manufactured by the device of the present invention is arranged on a wiring board 15. The same reference numerals are attached to members similar to those of the above-described embodiment. In this embodiment, the shapes of the support projections 17a and 17b are different from those of the embodiment shown in FIGS. 1 to 6. The shape of the support protrusion 13c of this embodiment is substantially semicircular,
The surface in contact with 5 is a plane. Therefore, the same effect as in the above-described embodiment can be obtained.
第８図は、本考案の装置によつて製造されたさらに他
の回路部品11cを配線基板18に配置した側断面図であ
る。配線基板18は紙から成り、配線基板18に形成されて
いる挿通孔19の内壁19aは略半円形に突出している。こ
のため、回路部品11cのリード13dに本体12と直交する方
向に形成される支持突起17bは略菱形に形成されてお
り、挿通孔19の内壁19aの上部に支持突起17dが挿入さ
れ、回路部品11cが配線基板18に安定に配置される。こ
の実施例においても前述の実施例と同様の効果が得られ
る。FIG. 8 is a side sectional view in which still another circuit component 11c manufactured by the device of the present invention is arranged on a wiring board 18. FIG. The wiring board 18 is made of paper, and an inner wall 19a of an insertion hole 19 formed in the wiring board 18 projects in a substantially semicircular shape. For this reason, the support projection 17b formed in the direction perpendicular to the main body 12 on the lead 13d of the circuit component 11c is formed in a substantially rhombic shape, and the support projection 17d is inserted above the inner wall 19a of the insertion hole 19, and the circuit component 11c is stably arranged on the wiring board 18. In this embodiment, effects similar to those of the above-described embodiment can be obtained.
第９図は、本考案の装置によつて製造されたさらに他
の回路部品11dを配線基板18に配置した側断面図であ
る。本実施例においては、第８図に示される実施例と支
持突起17eの形状が異なり略円形となつている。この実
施例においても前述の実施例と同様の効果が得られる。FIG. 9 is a side sectional view showing another circuit component 11d manufactured by the apparatus of the present invention arranged on a wiring board 18. As shown in FIG. In this embodiment, the shape of the support projection 17e is different from that of the embodiment shown in FIG. 8 and is substantially circular. In this embodiment, effects similar to those of the above-described embodiment can be obtained.
第10図は、本考案の一実施例の回路部品製造装置21の
回路部品11の押圧時の底断面図である。回路部品11から
突出しているリード13,14を基板15に向けた後、回路部
品製造装置21の略コの字形の第１部材22の突出部22a,22
bの第10図左側面をリード13,14の第10図右側に配置し、
略コの字形の第２部材23の突出部23a,23bの第10図右側
面をリード13,14の第10図左側に配置する。第１および
第２部材22,23のリード13,14に対応する位置には凹部22
c,22d,23c,23dが形成されている。矢符Ｄ方向にエアシ
リンダ24を用いて押圧することによつて、リード13,14
に本体12と直交する方向に支持突起17a,17bを容易に形
成することができる。FIG. 10 is a bottom sectional view of the circuit component manufacturing apparatus 21 according to the embodiment of the present invention when the circuit component 11 is pressed. After the leads 13 and 14 projecting from the circuit component 11 are directed toward the substrate 15, the projecting portions 22a and 22 of the substantially U-shaped first member 22 of the circuit component manufacturing apparatus 21 are formed.
Fig. 10 left side of b is arranged on the right side of leads 13 and 14 in Fig. 10,
The right side surfaces of the projecting portions 23a and 23b of the substantially U-shaped second member 23 in FIG. 10 are arranged on the left side of the leads 13 and 14 in FIG. The recesses 22 are located at positions corresponding to the leads 13 and 14 of the first and second members 22 and 23.
c, 22d, 23c and 23d are formed. By pressing with the air cylinder 24 in the direction of arrow D, the leads 13 and 14 are pressed.
The support projections 17a and 17b can be easily formed in a direction perpendicular to the main body 12.
以上のように本実施例によれば、回路基板上に実装さ
れたとき、傾斜を防止できる回路部品を、第１押圧部材
と第２押圧部材とから成る簡単な回路部品製造装置で押
圧するだけの簡単な工程で製造することができる。As described above, according to the present embodiment, when mounted on a circuit board, a circuit component that can prevent inclination is simply pressed by a simple circuit component manufacturing apparatus including a first pressing member and a second pressing member. Can be manufactured in a simple process.
考案の効果 本考案によれば、リード部材の突出位置に関する半径
方向と交差する方向に突出する支持突起を、簡単な装置
と工程でリード部材に形成することができる。またこの
ような支持突起を有する回路部品は、回路基板に実装さ
れた場合回路部品の傾斜が防止され、回路部品の品質低
下と実装密度の向上とを図ることができる。Effect of the Invention According to the present invention, a support projection projecting in a direction intersecting a radial direction with respect to a projecting position of a lead member can be formed on the lead member with a simple device and process. In addition, when the circuit component having such a support protrusion is mounted on a circuit board, the inclination of the circuit component is prevented, so that the quality of the circuit component can be reduced and the mounting density can be improved.
第１図は本考案の回路部品製造装置によつて製造された
回路部品11を配線基板15に配置した斜視図、第２図は第
１図に示される回路部品11を配線基板15に配置した正面
図、第３図は第１図に示される回路部品11を配線基板15
に配置した側面図、第４図は第２図の切断面線IV−IVか
ら見た側断面図、第５図は第２図の切断面線Ｖ−Ｖから
見た底断面図、第６図は第２図の切断面線VI−VIから見
た側断面図、第７図は本考案の回路部品製造装置によつ
て製造された他の回路部品11aを配線基板15に配置した
側断面図、第８図は本考案の回路部品製造装置によつて
製造されたさらに他の回路部品11cを配線基板18に配置
した側断面図、第９図は本考案の回路部品製造装置によ
つて製造されたさらに他の回路部品11dを配線基板18に
配置した側断面図、第10図は本考案の一実施例の回路部
品製造装置21を用いて回路部品11を製造するときの底断
面図、第11は従来使用されている回路部品１を示す図、
第12図は第11図に示される回路部品１の側面図、第13図
は第２の従来使用されている回路部品1aを示す図、第14
図は第13図の切断面線XV−XVから見た断面図である。 11,11a,11c,11d…回路部品、12…本体、13,13c,13d,13
e,14…リード、15,18…配線基板、16a,16b,19…挿通
孔、17a,17b,17c,17d,17e…支持突起、21…回路部品製
造装置、22…第１押圧部材、23…第２押圧部材FIG. 1 is a perspective view of the circuit component 11 manufactured by the circuit component manufacturing apparatus of the present invention arranged on a wiring board 15, and FIG. 2 is a perspective view of the circuit component 11 shown in FIG. FIG. 3 is a front view, and FIG.
4, FIG. 4 is a side sectional view taken along section line IV-IV in FIG. 2, FIG. 5 is a bottom sectional view taken along section line VV in FIG. 2, and FIG. FIG. 7 is a sectional side view taken along the line VI-VI of FIG. 2, and FIG. 7 is a sectional side view of another circuit component 11a manufactured by the circuit component manufacturing apparatus of the present invention arranged on a wiring board 15. FIG. 8 is a side sectional view showing still another circuit component 11c manufactured by the circuit component manufacturing apparatus of the present invention arranged on the wiring board 18, and FIG. 9 is a view showing the circuit component manufacturing apparatus of the present invention. FIG. 10 is a side cross-sectional view in which another manufactured circuit component 11d is arranged on a wiring board 18; 11 is a diagram showing a circuit component 1 conventionally used,
FIG. 12 is a side view of the circuit component 1 shown in FIG. 11, FIG. 13 is a diagram showing a second conventional circuit component 1a, and FIG.
The figure is a cross-sectional view taken along the section line XV-XV in FIG. 11,11a, 11c, 11d… Circuit parts, 12… Main body, 13,13c, 13d, 13
e, 14 lead, 15, 18 wiring board, 16a, 16b, 19 insertion hole, 17a, 17b, 17c, 17d, 17e support projection, 21 circuit device manufacturing apparatus, 22 first pressing member, 23 ... Second pressing member
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭55−84067（ＪＰ，Ａ) 実開 昭63−55491（ＪＰ，Ｕ) 実開 昭58−34727（ＪＰ，Ｕ) 実開 平２−13705（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H01G 13/00 H01G 4/228 ──────────────────────────────────────────────────続 き Continued from the front page (56) References JP-A-55-84067 (JP, A) JP-A-63-55491 (JP, U) JP-A-58-34727 (JP, U) JP-A-58-34727 13705 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H01G 13/00 H01G 4/228
Claims (1)
る２本のリード部材とを備える回路部品のリード部材に
該回路部品本体と直交する方向に支持突起を形成する回
路部品の製造装置であつて、 一方のリード部材の回路部品本体側および他方のリード
部材の反回路部品本体側に配置され、２本のリード部材
を押圧する前記回路部品本体と直交する方向に延びる一
対の第１押圧面を有する第１押圧部材と、 前記一方のリード部材の反回路部品本体側および前記他
方のリード部材の回路部品本体側に配置され、２本のリ
ード部材を押圧する前記回路部品本体と直交する方向に
延びる一対の第２押圧面を有する第２押圧部材とを含
み、 第１押圧部材および第２押圧部材で２本のリード部材を
押圧し、２本のリード部材の各押圧部分を前記第１押圧
面および前記第２押圧面に沿って延展させ、支持突起を
設けるようにしたことを特徴とする回路部品製造装置。An apparatus for manufacturing a circuit component, wherein a support projection is formed on a lead member of a circuit component having a circuit component body and two lead members protruding from the circuit component body in a direction orthogonal to the circuit component body. A pair of first pressing members disposed on the circuit component main body side of one lead member and on the opposite circuit component main body side of the other lead member and extending in a direction orthogonal to the circuit component main body pressing the two lead members. A first pressing member having a surface; a first pressing member disposed on a side opposite to the circuit component main body of the one lead member and a side of the circuit component main body of the other lead member, which are orthogonal to the circuit component main body pressing two lead members; A second pressing member having a pair of second pressing surfaces extending in the direction. The first pressing member and the second pressing member press the two lead members, and press each pressing portion of the two lead members to the second pressing member. One push Is spread along the surface and the second pressing surface, the circuit component manufacturing apparatus being characterized in that so as to provide a support protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128318U JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128318U JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485716U JPH0485716U (en) | 1992-07-24 |
| JP2592093Y2 true JP2592093Y2 (en) | 1999-03-17 |
Family
ID=31875784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990128318U Expired - Fee Related JP2592093Y2 (en) | 1990-11-29 | 1990-11-29 | Circuit component manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2592093Y2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5584067A (en) * | 1978-12-20 | 1980-06-24 | Hitachi Ltd | Misoperation preventing device for magnetic recorder/ reproducer |
| JPS5834727U (en) * | 1981-09-01 | 1983-03-07 | 松下電器産業株式会社 | Electronic components for printed circuit boards |
| JPS6355491U (en) * | 1986-09-25 | 1988-04-13 | ||
| JPH0213705U (en) * | 1988-07-11 | 1990-01-29 |
-
1990
- 1990-11-29 JP JP1990128318U patent/JP2592093Y2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0485716U (en) | 1992-07-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |