JPS59119035U - Ceramic package - Google Patents

Ceramic package

Info

Publication number
JPS59119035U
JPS59119035U JP1219283U JP1219283U JPS59119035U JP S59119035 U JPS59119035 U JP S59119035U JP 1219283 U JP1219283 U JP 1219283U JP 1219283 U JP1219283 U JP 1219283U JP S59119035 U JPS59119035 U JP S59119035U
Authority
JP
Japan
Prior art keywords
ceramic package
case
substrate part
sealed
protective film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1219283U
Other languages
Japanese (ja)
Inventor
宏明 高木
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1219283U priority Critical patent/JPS59119035U/en
Publication of JPS59119035U publication Critical patent/JPS59119035U/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のパッケージの封着部説明図、第2図は従
来のパッケージの側面図、第3図は本考案の実施例によ
るパッケージの封着部の説明図、第4図は本考案の実施
例によるパッケージの側面図を示す。 図において1はセラミック基板2は配線パターン、3は
樹脂、4はケース、5は保護膜を示す。
Fig. 1 is an explanatory diagram of the sealing part of a conventional package, Fig. 2 is a side view of the conventional package, Fig. 3 is an explanatory diagram of the sealing part of a package according to an embodiment of the present invention, and Fig. 4 is an explanatory diagram of the sealing part of the package according to the embodiment of the present invention. Figure 3 shows a side view of a package according to an embodiment. In the figure, reference numeral 1 indicates a ceramic substrate 2, a wiring pattern, 3 a resin, 4 a case, and 5 a protective film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂封着剤を介して基板部とケースとを封着するセラミ
ックパッケージにおいて、該基板部とケースとの封着部
の配線パターン上に保護膜を形成した事を特徴とするセ
ラミックパッケージ。
A ceramic package in which a substrate part and a case are sealed together via a resin sealing agent, characterized in that a protective film is formed on a wiring pattern of the sealed part between the substrate part and the case.
JP1219283U 1983-01-31 1983-01-31 Ceramic package Pending JPS59119035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1219283U JPS59119035U (en) 1983-01-31 1983-01-31 Ceramic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1219283U JPS59119035U (en) 1983-01-31 1983-01-31 Ceramic package

Publications (1)

Publication Number Publication Date
JPS59119035U true JPS59119035U (en) 1984-08-11

Family

ID=30143595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1219283U Pending JPS59119035U (en) 1983-01-31 1983-01-31 Ceramic package

Country Status (1)

Country Link
JP (1) JPS59119035U (en)

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