JPS5987142U - IC package - Google Patents

IC package

Info

Publication number
JPS5987142U
JPS5987142U JP18307782U JP18307782U JPS5987142U JP S5987142 U JPS5987142 U JP S5987142U JP 18307782 U JP18307782 U JP 18307782U JP 18307782 U JP18307782 U JP 18307782U JP S5987142 U JPS5987142 U JP S5987142U
Authority
JP
Japan
Prior art keywords
package
recorded
electronic filing
pancake
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18307782U
Other languages
Japanese (ja)
Inventor
島田　政見
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP18307782U priority Critical patent/JPS5987142U/en
Publication of JPS5987142U publication Critical patent/JPS5987142U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａはこの考案の一実施例におけるＩＣパッケージ
の平面図、同図Ｂは側面図、同図Ｃは前面図、同図りは
後面図、第２図Ａはこの考案の他の実施例におけるＩＣ
パッケージの前面図、同図Ｂはその後面図である。 １１・・・パッケージ、１２．１３・・・突起、１４・
・・リード。Figure 1A is a plan view of an IC package according to one embodiment of this invention, Figure B is a side view, Figure C is a front view, Figure 2 is a rear view, and Figure 2A is another embodiment of this invention. IC in
A front view of the package, and FIG. 1B is a rear view. 11...Package, 12.13...Protrusion, 14.
...Lead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ＩＣパンケージの前面及び後面に凸部あるいは凹部を設
けたことを特徴とするＩＣパッケージ。An IC package characterized by having convex portions or concave portions on the front and rear surfaces of the IC pancake.
JP18307782U 1982-12-02 1982-12-02 IC package Pending JPS5987142U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18307782U JPS5987142U (en) 1982-12-02 1982-12-02 IC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18307782U JPS5987142U (en) 1982-12-02 1982-12-02 IC package

Publications (1)

Publication Number Publication Date
JPS5987142U true JPS5987142U (en) 1984-06-13

Family

ID=30396318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18307782U Pending JPS5987142U (en) 1982-12-02 1982-12-02 IC package

Country Status (1)

Country Link
JP (1) JPS5987142U (en)

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