JPS6165684U - - Google Patents
Info
- Publication number
- JPS6165684U JPS6165684U JP14987584U JP14987584U JPS6165684U JP S6165684 U JPS6165684 U JP S6165684U JP 14987584 U JP14987584 U JP 14987584U JP 14987584 U JP14987584 U JP 14987584U JP S6165684 U JPS6165684 U JP S6165684U
- Authority
- JP
- Japan
- Prior art keywords
- socket
- integrated circuit
- semiconductor integrated
- circuit device
- resin surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 2
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来のフラツトパツケージ型ＩＣ試験用ソケ
ツトの上面図、第３図は第２図のソケツト用いて
ＩＣを装着した断面図である。
１，１１…ソケツト上蓋、２，１２…ソケツト
本体、３，１３…ソケツト上蓋に設けられた突起
、４，１４…ソケツト電極、５，１５…ＩＣ樹脂
部（本体）、６，７，１６，１７…ＩＣ外部リー
ド、８，１８…ＩＣ樹脂面、９，１９…ソケツト
上蓋凹部。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a top view of a conventional flat package type IC test socket, and FIG. 3 is a sectional view of an IC mounted using the socket of FIG. 2. DESCRIPTION OF SYMBOLS 1, 11... Socket top cover, 2, 12... Socket main body, 3, 13... Protrusion provided on the socket top cover, 4, 14... Socket electrode, 5, 15... IC resin part (main body), 6, 7, 16, 17...IC external lead, 8, 18...IC resin surface, 9, 19...socket top cover recess.
Claims (1)
をソケツト上蓋に設けられた構造を有する事を特
徴とする半導体集積回路装置用ソケツト。 1. A socket for a semiconductor integrated circuit device, characterized in that a portion for pressing the resin surface of the semiconductor integrated circuit device is provided on the upper lid of the socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14987584U JPS6165684U (en) | 1984-10-03 | 1984-10-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14987584U JPS6165684U (en) | 1984-10-03 | 1984-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6165684U true JPS6165684U (en) | 1986-05-06 |
Family
ID=30708042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14987584U Pending JPS6165684U (en) | 1984-10-03 | 1984-10-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6165684U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61114784U (en) * | 1984-12-28 | 1986-07-19 |
-
1984
- 1984-10-03 JP JP14987584U patent/JPS6165684U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61114784U (en) * | 1984-12-28 | 1986-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6165684U (en) | ||
| JPS6112245U (en) | semiconductor equipment | |
| JPS62157086U (en) | ||
| JPH01139441U (en) | ||
| JPH0267649U (en) | ||
| JPS59164241U (en) | Ceramic package | |
| JPS6364035U (en) | ||
| JPS61182036U (en) | ||
| JPS61114842U (en) | ||
| JPS62107458U (en) | ||
| JPS6450434U (en) | ||
| JPS6418778U (en) | ||
| JPS60113992U (en) | Socket for semiconductor integrated circuit device | |
| JPS63174452U (en) | ||
| JPS61207043U (en) | ||
| JPH01116454U (en) | ||
| JPS5834741U (en) | Resin-encapsulated semiconductor device | |
| JPS6170776U (en) | ||
| JPS61192447U (en) | ||
| JPS62122341U (en) | ||
| JPS62134240U (en) | ||
| JPS63108648U (en) | ||
| JPH01120341U (en) | ||
| JPH01176948U (en) | ||
| JPS63108641U (en) |