JPS62107458U - - Google Patents
Info
- Publication number
- JPS62107458U JPS62107458U JP20206985U JP20206985U JPS62107458U JP S62107458 U JPS62107458 U JP S62107458U JP 20206985 U JP20206985 U JP 20206985U JP 20206985 U JP20206985 U JP 20206985U JP S62107458 U JPS62107458 U JP S62107458U
- Authority
- JP
- Japan
- Prior art keywords
- fixing plate
- dam ring
- sealing
- semiconductor device
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図は本考案の回路基板の平面図、第2図は
第1図の―線断面図、第3図は他の実施例を
示す断面図、第4図はICカードにダムリングを
固着した断面図、第5図は従来例を示す断面図で
ある。
尚図中、A:回路基板、2:ダムリング、2a
:固着板、2b:起立板、4:マウント部を夫々
示す。
Fig. 1 is a plan view of the circuit board of the present invention, Fig. 2 is a sectional view taken along the line - - of Fig. 1, Fig. 3 is a sectional view showing another embodiment, and Fig. 4 is a dam ring fixed to an IC card. FIG. 5 is a sectional view showing a conventional example. In the figure, A: circuit board, 2: dam ring, 2a
:Fixing plate, 2b: Standing plate, 4: Mounting part, respectively.
Claims (1)
上面に一体的に突設した起立板とにより形成した
半導体素子のシール用ダムリング。 A dam ring for sealing a semiconductor device, in which a dam ring main body is formed of a thin fixing plate and an upright plate integrally protruding from the top surface of the fixing plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20206985U JPS62107458U (en) | 1985-12-24 | 1985-12-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20206985U JPS62107458U (en) | 1985-12-24 | 1985-12-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62107458U true JPS62107458U (en) | 1987-07-09 |
Family
ID=31166113
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20206985U Pending JPS62107458U (en) | 1985-12-24 | 1985-12-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62107458U (en) |
-
1985
- 1985-12-24 JP JP20206985U patent/JPS62107458U/ja active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS62107458U (en) | ||
JPS6418778U (en) | ||
JPS62182555U (en) | ||
JPS6196558U (en) | ||
JPS6165684U (en) | ||
JPS62192648U (en) | ||
JPS6245844U (en) | ||
JPS6364077U (en) | ||
JPS61188362U (en) | ||
JPS6096831U (en) | semiconductor chip | |
JPS6217170U (en) | ||
JPS61195054U (en) | ||
JPS6252942U (en) | ||
JPH01154643U (en) | ||
JPS63166473U (en) | ||
JPS6219752U (en) | ||
JPH0247052U (en) | ||
JPS61183540U (en) | ||
JPS61192480U (en) | ||
JPS6188248U (en) | ||
JPS6282743U (en) | ||
JPS60174253U (en) | Hybrid integrated circuit device | |
JPH02122436U (en) | ||
JPS62134240U (en) | ||
JPS61196542U (en) |