JPS6364035U - - Google Patents

Info

Publication number
JPS6364035U
JPS6364035U JP1986158925U JP15892586U JPS6364035U JP S6364035 U JPS6364035 U JP S6364035U JP 1986158925 U JP1986158925 U JP 1986158925U JP 15892586 U JP15892586 U JP 15892586U JP S6364035 U JPS6364035 U JP S6364035U
Authority
JP
Japan
Prior art keywords
bonding pad
film
view
utility
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986158925U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986158925U priority Critical patent/JPS6364035U/ja
Publication of JPS6364035U publication Critical patent/JPS6364035U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05557—Shape in side view comprising protrusions or indentations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4807—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H01L2224/48453—Shape of the interface with the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の縦断面図、第２図
は本考案の他の実施例の縦断面図、第３図は従来
のボンデイングパツドの断面図、第４図は従来の
ボンデイングパツドの上面図である。 １……ボンデイングワイヤー、２……導電性膜
、３……酸化膜、４……基板、５……保護膜、１
１……ボンデイングワイヤー、１２……導電性膜
、１３……下地膜、１４……酸化膜、１５……基
板、１６……保護膜、２１……ボンデイングワイ
ヤー、２２……導電性膜、２３……酸化膜、２４
……基板、３１……ボンデイングワイヤー、３２
……導電性膜、３３……突出した導電性膜、３４
……保護膜。 Fig. 1 is a longitudinal sectional view of one embodiment of the present invention, Fig. 2 is a longitudinal sectional view of another embodiment of the invention, Fig. 3 is a sectional view of a conventional bonding pad, and Fig. 4 is a longitudinal sectional view of a conventional bonding pad. FIG. 3 is a top view of the bonding pad. DESCRIPTION OF SYMBOLS 1... Bonding wire, 2... Conductive film, 3... Oxide film, 4... Substrate, 5... Protective film, 1
DESCRIPTION OF SYMBOLS 1... Bonding wire, 12... Conductive film, 13... Base film, 14... Oxide film, 15... Substrate, 16... Protective film, 21... Bonding wire, 22... Conductive film, 23 ...Oxide film, 24
...Substrate, 31...Bonding wire, 32
... Conductive film, 33 ... Protruding conductive film, 34
……Protective film.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に凹凸を有するボンデイングパツドを有す
ることを特徴とする半導体装置。 A semiconductor device characterized by having a bonding pad having an uneven surface.
JP1986158925U 1986-10-16 1986-10-16 Pending JPS6364035U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986158925U JPS6364035U (en) 1986-10-16 1986-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986158925U JPS6364035U (en) 1986-10-16 1986-10-16

Publications (1)

Publication Number Publication Date
JPS6364035U true JPS6364035U (en) 1988-04-27

Family

ID=31082874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986158925U Pending JPS6364035U (en) 1986-10-16 1986-10-16

Country Status (1)

Country Link
JP (1) JPS6364035U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041566A (en) * 2015-08-20 2017-02-23 セイコーエプソン株式会社 Semiconductor device and manufacturing method of the same, electronic apparatus and mobile object
WO2021240748A1 (en) * 2020-05-28 2021-12-02 三菱電機株式会社 Semiconductor device, method for producing same, and electric power converter

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017041566A (en) * 2015-08-20 2017-02-23 セイコーエプソン株式会社 Semiconductor device and manufacturing method of the same, electronic apparatus and mobile object
CN106469659A (en) * 2015-08-20 2017-03-01 精工爱普生株式会社 Semiconductor device and its manufacture method, electronic equipment and moving body
CN106469659B (en) * 2015-08-20 2021-08-10 精工爱普生株式会社 Semiconductor device, method for manufacturing same, electronic apparatus, and moving object
WO2021240748A1 (en) * 2020-05-28 2021-12-02 三菱電機株式会社 Semiconductor device, method for producing same, and electric power converter

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