JPH0310532U - - Google Patents
Info
- Publication number
- JPH0310532U JPH0310532U JP1989071992U JP7199289U JPH0310532U JP H0310532 U JPH0310532 U JP H0310532U JP 1989071992 U JP1989071992 U JP 1989071992U JP 7199289 U JP7199289 U JP 7199289U JP H0310532 U JPH0310532 U JP H0310532U
- Authority
- JP
- Japan
- Prior art keywords
- electrode pad
- window opening
- insulating film
- semiconductor element
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
Description
第１図は本考案に係る半導体装置の一実施例を
示すその半導体素子の要部側断面図、第２図と第
３図は従来の半導体装置の一具体例を示すその半
導体素子の平面図とその要部側断面図である。
１……半導体素子、２……第１電極パツド、４
……絶縁膜、４ａ……窓開け部、６……第２電極
パツド、６ａ……周縁部。
FIG. 1 is a sectional side view of a main part of a semiconductor device showing an embodiment of a semiconductor device according to the present invention, and FIGS. 2 and 3 are plan views of the semiconductor device showing a specific example of a conventional semiconductor device. FIG. 1... Semiconductor element, 2... First electrode pad, 4
...Insulating film, 4a...Window opening, 6...Second electrode pad, 6a...Periphery.
Claims (1)
る絶縁膜を被着・形成した半導体素子からなり、 上記窓開け部に、その周縁部から絶縁膜上を被
覆する第２電極パツドを積層して形成したことを
特徴とする半導体装置。[Scope of Claim for Utility Model Registration] A semiconductor element is comprised of a semiconductor element in which an insulating film having a window opening is adhered and formed on the surface on which a first electrode pad is disposed, and the insulating film is coated from the periphery of the window opening to the window opening. 1. A semiconductor device characterized in that it is formed by laminating a second electrode pad that covers a second electrode pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071992U JPH0310532U (en) | 1989-06-20 | 1989-06-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989071992U JPH0310532U (en) | 1989-06-20 | 1989-06-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0310532U true JPH0310532U (en) | 1991-01-31 |
Family
ID=31609525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989071992U Pending JPH0310532U (en) | 1989-06-20 | 1989-06-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0310532U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291561A (en) * | 2006-04-25 | 2007-11-08 | L Rose:Kk | Undergarment sewn together with silk fabric on inside whole surface |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5192171A (en) * | 1975-02-10 | 1976-08-12 | ||
| JPS5295171A (en) * | 1976-02-06 | 1977-08-10 | Hitachi Ltd | Electrode for semi-conductor |
| JPS6338236A (en) * | 1986-08-01 | 1988-02-18 | Fujitsu Ltd | Semiconductor device |
-
1989
- 1989-06-20 JP JP1989071992U patent/JPH0310532U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5192171A (en) * | 1975-02-10 | 1976-08-12 | ||
| JPS5295171A (en) * | 1976-02-06 | 1977-08-10 | Hitachi Ltd | Electrode for semi-conductor |
| JPS6338236A (en) * | 1986-08-01 | 1988-02-18 | Fujitsu Ltd | Semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007291561A (en) * | 2006-04-25 | 2007-11-08 | L Rose:Kk | Undergarment sewn together with silk fabric on inside whole surface |