JPH01120341U - - Google Patents
Info
- Publication number
- JPH01120341U JPH01120341U JP1988014701U JP1470188U JPH01120341U JP H01120341 U JPH01120341 U JP H01120341U JP 1988014701 U JP1988014701 U JP 1988014701U JP 1470188 U JP1470188 U JP 1470188U JP H01120341 U JPH01120341 U JP H01120341U
- Authority
- JP
- Japan
- Prior art keywords
- sectional
- capacitor
- power
- view
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図は本考案の第１の実施例の横断面図、第
２図は、第１図のａ―ａ′線縦断面図、第３図は
、第２の実施例の横断面図、第４図は第３図のａ
―ａ′線縦断面図、第５図は、従来の横断面図、
第６図は、第５図のａ―ａ′線縦断面図である。
１…ＩＣ本体、２…アイランド、３…ＩＣチツ
プ、４…第１の電源リード、５…第２の電源リー
ド、６…第１の電源パツド、７…第２の電源パツ
ド、８…第１の電源ワイヤ、９…第２の電源ワイ
ヤ、１０…コンデンサ、１１…コンデンサの第１
の電極、１２…コンデンサの第２の電極、１３，
１４…絶縁性樹脂、１５，１６…導電性樹脂、１
７…第１の電源リード―アイランド接続部、１８
…絶縁性又は導電性樹脂。
FIG. 1 is a cross-sectional view of the first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view taken along line a-a' in FIG. 1, and FIG. 3 is a cross-sectional view of the second embodiment. Figure 4 is a of Figure 3.
-A'-line longitudinal cross-sectional view; FIG. 5 is a conventional cross-sectional view;
FIG. 6 is a longitudinal sectional view taken along the line aa' in FIG. 5. DESCRIPTION OF SYMBOLS 1... IC body, 2... Island, 3... IC chip, 4... First power lead, 5... Second power lead, 6... First power pad, 7... Second power pad, 8... First power pad power wire, 9...second power wire, 10...capacitor, 11...first capacitor
electrode, 12... second electrode of the capacitor, 13,
14... Insulating resin, 15, 16... Conductive resin, 1
7...First power lead-island connection, 18
...Insulating or conductive resin.
Claims (1)
を有することを特徴とする半導体装置。 A semiconductor device characterized by having a capacitor in a frame on which a semiconductor chip is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988014701U JPH01120341U (en) | 1988-02-05 | 1988-02-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988014701U JPH01120341U (en) | 1988-02-05 | 1988-02-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120341U true JPH01120341U (en) | 1989-08-15 |
Family
ID=31226138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988014701U Pending JPH01120341U (en) | 1988-02-05 | 1988-02-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120341U (en) |
-
1988
- 1988-02-05 JP JP1988014701U patent/JPH01120341U/ja active Pending