JPS63172135U - - Google Patents
Info
- Publication number
- JPS63172135U JPS63172135U JP6547087U JP6547087U JPS63172135U JP S63172135 U JPS63172135 U JP S63172135U JP 6547087 U JP6547087 U JP 6547087U JP 6547087 U JP6547087 U JP 6547087U JP S63172135 U JPS63172135 U JP S63172135U
- Authority
- JP
- Japan
- Prior art keywords
- header
- cap
- disposed
- semiconductor element
- covering plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Semiconductor Lasers (AREA)
Description
第１図は本考案の実施例を示す斜視図、第２図
は同断面図、第３図はリードフレームを示す平面
図、第４図は従来例を示す一部断面図である。
１……半導体レーザ装置、２……半導体レーザ
チツプ、３……取付部、４……電極部、５……ヘ
ツダ、６……被覆板、７……キヤツプ。
FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a plan view showing a lead frame, and FIG. 4 is a partial sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1... Semiconductor laser device, 2... Semiconductor laser chip, 3... Mounting section, 4... Electrode section, 5... Header, 6... Covering plate, 7... Cap.
Claims (1)
体に保持するようにヘツダを設け、且つ該ヘツダ
の下面に沿つて被覆板を添設すると共に、前期被
覆板と同一の材料で形成されたキヤツプを、前記
半導体素子を封止するようにヘツダの上面側に配
し、前記被覆板とキヤツプとを気密的に接着した
ことを特徴とする半導体装置。 A header is provided to hold the mounting part on which the semiconductor element is disposed and the electrode part together, and a covering plate is attached along the lower surface of the header, and the header is made of the same material as the previous covering plate. A semiconductor device characterized in that a cap is disposed on the upper surface side of the header so as to seal the semiconductor element, and the cover plate and the cap are airtightly bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6547087U JPS63172135U (en) | 1987-04-30 | 1987-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6547087U JPS63172135U (en) | 1987-04-30 | 1987-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63172135U true JPS63172135U (en) | 1988-11-09 |
Family
ID=30902569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6547087U Pending JPS63172135U (en) | 1987-04-30 | 1987-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63172135U (en) |
-
1987
- 1987-04-30 JP JP6547087U patent/JPS63172135U/ja active Pending