JPH0167759U - - Google Patents
Info
- Publication number
- JPH0167759U JPH0167759U JP1987162993U JP16299387U JPH0167759U JP H0167759 U JPH0167759 U JP H0167759U JP 1987162993 U JP1987162993 U JP 1987162993U JP 16299387 U JP16299387 U JP 16299387U JP H0167759 U JPH0167759 U JP H0167759U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- lid
- bonded
- metal
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Description
第１図はこの考案の一実施例である金属封止形
パツケージの上面図、第２図は第１図の部分拡大
斜視図、第３図は従来の金属封止形パツケージの
斜視図、第４図は第３図の−線における断面
図である。なお、図において、１は蓋、２はセラ
ミツク、３はトツプフランジ、４はダイパツド、
５は外部リード線、６は溶着封止材、７は半導体
素子、８はインナーリード線、９は内部リード線
、１０は蓋１の突起部分である。図中、同一符号
は同一、又は相当部分を示す。
Fig. 1 is a top view of a metal-sealed package which is an embodiment of this invention, Fig. 2 is a partially enlarged perspective view of Fig. 1, and Fig. 3 is a perspective view of a conventional metal-sealed package. FIG. 4 is a sectional view taken along the - line in FIG. 3. In addition, in the figure, 1 is a lid, 2 is a ceramic, 3 is a top flange, 4 is a die pad,
5 is an external lead wire, 6 is a welding sealing material, 7 is a semiconductor element, 8 is an inner lead wire, 9 is an internal lead wire, and 10 is a protruding portion of the lid 1. In the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
接地したことを特徴とする半導体装置。 (2) 前記蓋は金属封止形パツケージの上面を全
て覆つたことを特徴とする実用新案登録請求の範
囲第１項記載の半導体装置。 (3) 前記蓋に突起部分をもうけ、この突起部分
を半導体素子と接着している導電性金属に接合し
たことを特徴とする実用新案登録請求の範囲第１
項記載の半導体装置。 (4) 半導体素子と接着している導電性金属は接
地されていることを特徴とする実用新案登録請求
の範囲第１項記載の半導体装置。[Claims for Utility Model Registration] (1) A semiconductor device characterized in that the lid of a metal-sealed package of a semiconductor element is grounded. (2) The semiconductor device according to claim 1, wherein the lid completely covers the upper surface of the metal-sealed package. (3) Utility model registration claim 1, characterized in that the lid has a protruding portion, and this protruding portion is bonded to a conductive metal that is bonded to a semiconductor element.
1. Semiconductor device described in Section 1. (4) The semiconductor device according to claim 1, wherein the conductive metal bonded to the semiconductor element is grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162993U JPH0167759U (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987162993U JPH0167759U (en) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0167759U true JPH0167759U (en) | 1989-05-01 |
Family
ID=31447319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987162993U Pending JPH0167759U (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0167759U (en) |
-
1987
- 1987-10-23 JP JP1987162993U patent/JPH0167759U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0369248U (en) | ||
| JPH0167759U (en) | ||
| JPH02125345U (en) | ||
| JPH0477230U (en) | ||
| JPH01165649U (en) | ||
| JPH03101524U (en) | ||
| JPH0176050U (en) | ||
| JPS5849443U (en) | Packages for semiconductor devices | |
| JPS6343443U (en) | ||
| JPS5839046U (en) | semiconductor package | |
| JPH0270450U (en) | ||
| JPH01174939U (en) | ||
| JPH0485736U (en) | ||
| JPS63172135U (en) | ||
| JPH0373444U (en) | ||
| JPH03124653U (en) | ||
| JPH03101539U (en) | ||
| JPH0323938U (en) | ||
| JPS6282745U (en) | ||
| JPS6252936U (en) | ||
| JPH0325242U (en) | ||
| JPH02132954U (en) | ||
| JPS63191651U (en) | ||
| JPH0213740U (en) | ||
| JPS63174459U (en) |