JPH0323938U - - Google Patents
Info
- Publication number
- JPH0323938U JPH0323938U JP1989083410U JP8341089U JPH0323938U JP H0323938 U JPH0323938 U JP H0323938U JP 1989083410 U JP1989083410 U JP 1989083410U JP 8341089 U JP8341089 U JP 8341089U JP H0323938 U JPH0323938 U JP H0323938U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- metal cap
- wiring board
- flange
- hermetically sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Casings For Electric Apparatus (AREA)
Description
第１図及び第２図は本考案にかかり、第１図は
金属キヤツプの要部形状を示す破断斜視図であり
、第２図は半田付け接合時の要部状態を拡大して
示す断面図である。また、第３図及び第４図は従
来例に係り、第３図はハイブリツドＩＣの構造を
示す断面図、第４図ａ，ｂは半田付け接合時の要
部状態を拡大して示す断面図である。
図における符号２……配線基板、４……金属キ
ヤツプ、４ａ……鍔部、４ｂ……突起部、５……
半田である。なお、図中の同一符号は、互いに同
一もしくは相当する部品、部分を示している。
Figures 1 and 2 are related to the present invention; Figure 1 is a broken perspective view showing the shape of the main part of the metal cap, and Figure 2 is an enlarged sectional view showing the state of the main part during soldering. It is. Furthermore, FIGS. 3 and 4 relate to conventional examples, where FIG. 3 is a sectional view showing the structure of a hybrid IC, and FIGS. It is. Reference numeral 2 in the figure...wiring board, 4...metal cap, 4a...flange, 4b...protrusion, 5...
It's solder. Note that the same reference numerals in the figures indicate the same or corresponding parts and portions.
Claims (1)
ヤツプの周縁に形成された鍔部とを半田付け接合
してなるハイブリツドＩＣの気密封止構造におい
て、 前記金属キヤツプの鍔部に、前記配線基板に向
かつて突出する複数の突起部を形成したことを特
徴とするハイブリツドＩＣの気密封止構造。[Claims for Utility Model Registration] In the hermetically sealed structure of a hybrid IC formed by soldering and joining a surface peripheral portion of a wiring board and a flange formed at the peripheral edge of a metal cap covering the surface, said metal cap A hermetically sealed structure for a hybrid IC, characterized in that a plurality of protrusions projecting toward the wiring board are formed on a flange of the IC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989083410U JPH0323938U (en) | 1989-07-14 | 1989-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989083410U JPH0323938U (en) | 1989-07-14 | 1989-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323938U true JPH0323938U (en) | 1991-03-12 |
Family
ID=31631057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989083410U Pending JPH0323938U (en) | 1989-07-14 | 1989-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323938U (en) |
-
1989
- 1989-07-14 JP JP1989083410U patent/JPH0323938U/ja active Pending