JPS63200379U

JPS63200379U -

Info

Publication number: JPS63200379U
Application number: JP9267487U
Authority: JP
Priority date: 1987-06-15
Filing date: 1987-06-15
Publication date: 1988-12-23

Description

[Brief explanation of the drawing]

第１図は本考案の実施例に係る電子機器用ケー
スの斜視図、第２図は第１図の一部拡大図、第３
図は第１図の電子機器用ケースを横倒した状態を
示す斜視図、第４図は第３図の一部拡大図、第５
図は他の実施例に係る電子機器用ケースの一部拡
大図、第６図は従来例に係る電子機器用ケースの
斜視図、第７図は第６図の―断面図である。１１……電子機器用ケース、１２……ケース本
体、１２ａ……ケース本体の側板、１３……蓋体
、１３ａ……蓋体の上板、１４……半田、１５…
…凹部。 FIG. 1 is a perspective view of an electronic device case according to an embodiment of the present invention, FIG. 2 is a partially enlarged view of FIG. 1, and FIG.
The figure is a perspective view showing the state in which the electronic device case in Figure 1 is laid down, Figure 4 is a partially enlarged view of Figure 3, and Figure 5 is a partially enlarged view of Figure 3.
The figure is a partially enlarged view of a case for electronic equipment according to another embodiment, FIG. 6 is a perspective view of a case for electronic equipment according to a conventional example, and FIG. 7 is a cross-sectional view taken from FIG. 6. DESCRIPTION OF SYMBOLS 11... Case for electronic equipment, 12... Case body, 12a... Side plate of case body, 13... Lid body, 13a... Upper plate of lid body, 14... Solder, 15...
...concavity.

Claims

[Scope of utility model registration request]

In an electronic device case in which a metal lid body is fitted to a metal case body and an opening of the case body is covered by the lid body, a recess is formed in the top plate of the lid body, This recess is cut out at the part facing the inner surface of the side plate of the case body, and
A case for an electronic device characterized in that solder is poured into the recess and the recess and the inner surface of the side plate are soldered.