JPS63145593U - - Google Patents

Info

Publication number
JPS63145593U
JPS63145593U JP3327687U JP3327687U JPS63145593U JP S63145593 U JPS63145593 U JP S63145593U JP 3327687 U JP3327687 U JP 3327687U JP 3327687 U JP3327687 U JP 3327687U JP S63145593 U JPS63145593 U JP S63145593U
Authority
JP
Japan
Prior art keywords
solder
welding
utility
view
scope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3327687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3327687U priority Critical patent/JPS63145593U/ja
Publication of JPS63145593U publication Critical patent/JPS63145593U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案を真上から見た平面図、第2図
は本考案を真横から見た縦断面図、第3図は本考
案の斜視図、第4図は本考案の使用状態を示す斜
視図、第5図は本考案の斜視図、第6図は本考案
の縦断面図、第7図は従来のはんだの斜視図であ
る。 1……本体、2……リング中心部、3……フラ
ツクス、4……端子、5……基板、6……パター
ン。
Figure 1 is a plan view of the present invention viewed from directly above, Figure 2 is a vertical sectional view of the present invention viewed from the side, Figure 3 is a perspective view of the present invention, and Figure 4 shows the use of the present invention. FIG. 5 is a perspective view of the present invention, FIG. 6 is a vertical sectional view of the present invention, and FIG. 7 is a perspective view of a conventional solder. 1... Main body, 2... Ring center, 3... Flux, 4... Terminal, 5... Board, 6... Pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を溶接する為のはんだにおいて、はん
だがリング状に構成され、当該はんだに溶接に必
要な量のフラツクスが付帯していることを特徴と
するはんだ。
A solder for welding electronic parts, characterized in that the solder is formed into a ring shape and has an amount of flux necessary for welding attached to the solder.
JP3327687U 1987-03-06 1987-03-06 Pending JPS63145593U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3327687U JPS63145593U (en) 1987-03-06 1987-03-06

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3327687U JPS63145593U (en) 1987-03-06 1987-03-06

Publications (1)

Publication Number Publication Date
JPS63145593U true JPS63145593U (en) 1988-09-26

Family

ID=30840739

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3327687U Pending JPS63145593U (en) 1987-03-06 1987-03-06

Country Status (1)

Country Link
JP (1) JPS63145593U (en)

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