JPS62140791U - - Google Patents

Info

Publication number
JPS62140791U
JPS62140791U JP2840486U JP2840486U JPS62140791U JP S62140791 U JPS62140791 U JP S62140791U JP 2840486 U JP2840486 U JP 2840486U JP 2840486 U JP2840486 U JP 2840486U JP S62140791 U JPS62140791 U JP S62140791U
Authority
JP
Japan
Prior art keywords
frame
metal
metal chip
soldering structure
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2840486U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2840486U priority Critical patent/JPS62140791U/ja
Publication of JPS62140791U publication Critical patent/JPS62140791U/ja
Pending legal-status Critical Current

Links

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係る半田付け構体
の一部切欠斜視図、第2図は同実施例の要部拡大
断面図、第3図は本考案の他の実施例の要部拡大
断面図、第4図は金属チツプの他の一例を示す斜
視図、第5図は従来の半田付け構体の一例を示す
一部拡大切欠斜視図、第6図は同半田付け構体の
部分拡大断面図、第7図は従来の半田付け構体の
他の例を示す部分拡大断面図である。 1…枠体、3…プリント基板、6…半田、9,
9a,9b…金属チツプ。
Fig. 1 is a partially cutaway perspective view of a soldering structure according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the main part of the same embodiment, and Fig. 3 is a main part of another embodiment of the invention. 4 is a perspective view showing another example of a metal chip, FIG. 5 is a partially enlarged cutaway perspective view showing an example of a conventional soldering structure, and FIG. 6 is a partially enlarged view of the same soldering structure. 7 is a partially enlarged sectional view showing another example of a conventional soldering structure. 1...Frame body, 3...Printed circuit board, 6...Solder, 9,
9a, 9b...Metal chips.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 周縁部に金属チツプを固定したプリント基板を
金属製の枠体に嵌合し、金属チツプと枠体の対向
面間を半田を介して固定したことを特徴とする半
田付け構体。
A soldering structure characterized in that a printed circuit board with a metal chip fixed to the peripheral edge thereof is fitted into a metal frame, and the opposing surfaces of the metal chip and the frame are fixed via solder.
JP2840486U 1986-02-27 1986-02-27 Pending JPS62140791U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2840486U JPS62140791U (en) 1986-02-27 1986-02-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2840486U JPS62140791U (en) 1986-02-27 1986-02-27

Publications (1)

Publication Number Publication Date
JPS62140791U true JPS62140791U (en) 1987-09-05

Family

ID=30831332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2840486U Pending JPS62140791U (en) 1986-02-27 1986-02-27

Country Status (1)

Country Link
JP (1) JPS62140791U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251032A (en) * 2006-03-17 2007-09-27 Alps Electric Co Ltd Connection structure of circuit board and frame body
JP2007251033A (en) * 2006-03-17 2007-09-27 Alps Electric Co Ltd Connection structure of circuit board and frame body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251032A (en) * 2006-03-17 2007-09-27 Alps Electric Co Ltd Connection structure of circuit board and frame body
JP2007251033A (en) * 2006-03-17 2007-09-27 Alps Electric Co Ltd Connection structure of circuit board and frame body
JP4580884B2 (en) * 2006-03-17 2010-11-17 アルプス電気株式会社 Connection structure of circuit board and frame

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