JPS62140790U - - Google Patents
Info
- Publication number
- JPS62140790U JPS62140790U JP2840386U JP2840386U JPS62140790U JP S62140790 U JPS62140790 U JP S62140790U JP 2840386 U JP2840386 U JP 2840386U JP 2840386 U JP2840386 U JP 2840386U JP S62140790 U JPS62140790 U JP S62140790U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- metal body
- circuit board
- printed circuit
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案の一実施例に係る半田付け構体
の一部切欠斜視図、第２図は同実施例の要部拡大
断面図、第３図は本考案の他の実施例の要部拡大
断面図、第４図及び第５図は金属体の変形例を示
す側面図、第６図はプリント基板の一例を示す要
部平面図、第７図は本考案の更に他の実施例を示
す要部拡大断面図、第８図は金属体の更に他の変
形例を示す斜視図、第９図は従来の半田付け構体
の一例を示す一部拡大切欠斜視図、第１０図は同
従来例の部分拡大断面図、第１１図は従来の半田
付け構体の他の例を示す部分拡大断面図である。
１…枠体、３…プリント基板、６…半田、１０
，１０ａ，１０ｂ，１０ｃ，１０ｄ…金属体。
Fig. 1 is a partially cutaway perspective view of a soldering structure according to an embodiment of the present invention, Fig. 2 is an enlarged sectional view of the main part of the same embodiment, and Fig. 3 is a main part of another embodiment of the invention. 4 and 5 are side views showing modified examples of the metal body, FIG. 6 is a plan view of essential parts showing an example of a printed circuit board, and FIG. 7 shows still another embodiment of the present invention. 8 is a perspective view showing still another modified example of the metal body, FIG. 9 is a partially enlarged cutaway perspective view showing an example of a conventional soldering structure, and FIG. 10 is a perspective view showing the same conventional soldering structure. FIG. 11 is a partially enlarged sectional view showing another example of a conventional soldering structure. 1... Frame body, 3... Printed circuit board, 6... Solder, 10
, 10a, 10b, 10c, 10d...metal bodies.
Claims (1)
製の枠体に嵌合し、金属体の一端を枠体の内面に
近接させると共に金属体の一端部側と枠体の内面
との間に半田を保持させて枠体にプリント基板を
固定したことを特徴とする半田付け構体。 A printed circuit board with a metal body implanted on the peripheral edge is fitted into a metal frame, one end of the metal body is brought close to the inner surface of the frame, and there is a space between one end of the metal body and the inner surface of the frame. A soldering structure characterized by fixing a printed circuit board to a frame by holding solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2840386U JPS62140790U (en) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2840386U JPS62140790U (en) | 1986-02-27 | 1986-02-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62140790U true JPS62140790U (en) | 1987-09-05 |
Family
ID=30831329
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2840386U Pending JPS62140790U (en) | 1986-02-27 | 1986-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140790U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574437U (en) * | 1980-06-05 | 1982-01-11 | ||
| JPS60231394A (en) * | 1984-04-27 | 1985-11-16 | 松下電器産業株式会社 | Electronic circuit device |
-
1986
- 1986-02-27 JP JP2840386U patent/JPS62140790U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS574437U (en) * | 1980-06-05 | 1982-01-11 | ||
| JPS60231394A (en) * | 1984-04-27 | 1985-11-16 | 松下電器産業株式会社 | Electronic circuit device |