JPS62178596U - - Google Patents
Info
- Publication number
- JPS62178596U JPS62178596U JP1986066629U JP6662986U JPS62178596U JP S62178596 U JPS62178596 U JP S62178596U JP 1986066629 U JP1986066629 U JP 1986066629U JP 6662986 U JP6662986 U JP 6662986U JP S62178596 U JPS62178596 U JP S62178596U
- Authority
- JP
- Japan
- Prior art keywords
- metal chassis
- circuit board
- printed circuit
- tongue piece
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の実施例を示す接続構体の斜視
図、第２図は第１図Ａ―Ａ断面図、第３図は第１
図の要部斜視図、第４図は本考案接続構体の半田
付けを説明するための要部断面図、第５図は切抜
き舌片の他の例を示す要部側断面図、第６図は従
来の接続構体の一例を示す斜視図である。
１……プリント基板、２……金属シヤーシ、７
……半田、８……切抜き舌片、９……導電パター
ン。
Figure 1 is a perspective view of a connection structure showing an embodiment of the present invention, Figure 2 is a sectional view taken along line A-A in Figure 1, and Figure 3 is a
Fig. 4 is a sectional view of the main part for explaining the soldering of the connection structure of the present invention; Fig. 5 is a side sectional view of the main part showing another example of the cutout tongue; Fig. 6 FIG. 2 is a perspective view showing an example of a conventional connection structure. 1...Printed circuit board, 2...Metal chassis, 7
... Solder, 8 ... Cutout tongue piece, 9 ... Conductive pattern.
Claims (1)
部導電パターンと金属シヤーシの内周面との半田
接続構体において、上記金属シヤーシに、プリン
ト基板の側周面を横切りかつ遊端がプリント基板
の裏面より突出した切抜き舌片を設け、この舌片
を金属シヤーシ内方に折り曲げると共に舌片の遊
端部と前記導電パターン間を半田固定したことを
特徴とするプリント基板と金属シヤーシの接続構
体。 In a solder connection structure between a peripheral conductive pattern of a printed circuit board surrounded by a metal chassis and an inner circumferential surface of the metal chassis, the metal chassis is provided with a free end that crosses the side circumferential surface of the printed circuit board and protrudes from the back surface of the printed circuit board. 1. A connection structure for connecting a printed circuit board and a metal chassis, characterized in that a cutout tongue piece is provided, the tongue piece is bent inward of the metal chassis, and a free end of the tongue piece and the conductive pattern are fixed by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066629U JPH0225273Y2 (en) | 1986-04-30 | 1986-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986066629U JPH0225273Y2 (en) | 1986-04-30 | 1986-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62178596U true JPS62178596U (en) | 1987-11-12 |
| JPH0225273Y2 JPH0225273Y2 (en) | 1990-07-11 |
Family
ID=30904813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986066629U Expired JPH0225273Y2 (en) | 1986-04-30 | 1986-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225273Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145200U (en) * | 1988-03-29 | 1989-10-05 | ||
| JPH02797U (en) * | 1988-06-13 | 1990-01-05 | ||
| JPH02113390U (en) * | 1989-02-25 | 1990-09-11 | ||
| DE19711325C2 (en) * | 1996-03-18 | 2003-04-17 | Alps Electric Co Ltd | Fastening construction for printed circuit boards |
| JP2013210375A (en) * | 2006-08-09 | 2013-10-10 | Seiko Epson Corp | Inertial sensor device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49112165A (en) * | 1973-02-28 | 1974-10-25 | ||
| JPS55139596U (en) * | 1979-03-24 | 1980-10-04 | ||
| JPS5780926U (en) * | 1980-10-31 | 1982-05-19 | ||
| JPS5918488U (en) * | 1982-07-26 | 1984-02-04 | アルプス電気株式会社 | Board holding structure for electronic equipment |
| JPS59125888U (en) * | 1983-02-09 | 1984-08-24 | 日本電気ホームエレクトロニクス株式会社 | shield structure |
| JPS59132692U (en) * | 1983-02-24 | 1984-09-05 | シャープ株式会社 | Heat sink mounting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5918488B2 (en) * | 1980-08-15 | 1984-04-27 | 三井建設株式会社 | Slime processing method in stable liquid drilling method |
-
1986
- 1986-04-30 JP JP1986066629U patent/JPH0225273Y2/ja not_active Expired
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49112165A (en) * | 1973-02-28 | 1974-10-25 | ||
| JPS55139596U (en) * | 1979-03-24 | 1980-10-04 | ||
| JPS5780926U (en) * | 1980-10-31 | 1982-05-19 | ||
| JPS5918488U (en) * | 1982-07-26 | 1984-02-04 | アルプス電気株式会社 | Board holding structure for electronic equipment |
| JPS59125888U (en) * | 1983-02-09 | 1984-08-24 | 日本電気ホームエレクトロニクス株式会社 | shield structure |
| JPS59132692U (en) * | 1983-02-24 | 1984-09-05 | シャープ株式会社 | Heat sink mounting device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01145200U (en) * | 1988-03-29 | 1989-10-05 | ||
| JPH02797U (en) * | 1988-06-13 | 1990-01-05 | ||
| JPH02113390U (en) * | 1989-02-25 | 1990-09-11 | ||
| DE19711325C2 (en) * | 1996-03-18 | 2003-04-17 | Alps Electric Co Ltd | Fastening construction for printed circuit boards |
| JP2013210375A (en) * | 2006-08-09 | 2013-10-10 | Seiko Epson Corp | Inertial sensor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225273Y2 (en) | 1990-07-11 |