JPS62186485U - - Google Patents
Info
- Publication number
- JPS62186485U JPS62186485U JP7431986U JP7431986U JPS62186485U JP S62186485 U JPS62186485 U JP S62186485U JP 7431986 U JP7431986 U JP 7431986U JP 7431986 U JP7431986 U JP 7431986U JP S62186485 U JPS62186485 U JP S62186485U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- frame
- holding frame
- assembly structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 210000000078 claw Anatomy 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 1
Description
第１図は本考案に係るプリント基板の組付構造
を示す分解斜視図、第２図は同半田付作業を示す
概略正面図、第３図は同組付状態を示す要部断面
図、第４図は従来例の組付構造を示す分解斜視図
、第５図は同半田付作業を示す概略正面図、第６
図は同組付状態を示す要部断面図である。
２０……プリント基板、２２……アースパター
ン、２３……枠体、２７……抑え枠、２９……折
曲片、３０……爪片。
FIG. 1 is an exploded perspective view showing the assembly structure of the printed circuit board according to the present invention, FIG. 2 is a schematic front view showing the soldering work, FIG. Figure 4 is an exploded perspective view showing a conventional assembly structure, Figure 5 is a schematic front view showing the same soldering work, and Figure 6 is a schematic front view showing the soldering work.
The figure is a sectional view of the main parts showing the assembled state. 20... Printed circuit board, 22... Earth pattern, 23... Frame body, 27... Holding frame, 29... Bending piece, 30... Claw piece.
Claims (1)
え枠を組み込み、その抑え枠を介して前記枠体と
プリント基板に形成されたアースパターンが半田
付けで一体的に接続されたプリント基板の組付構
造において、前記抑え枠は外縁に折曲片を形成し
た断面略Ｌ字状のものとし、内縁には爪片を形成
してあることを特徴とするプリント基板の組付構
造。 In a printed circuit board assembly structure in which a printed circuit board and a holding frame for the printed circuit board are incorporated in a frame, and an earth pattern formed on the frame and the printed circuit board are integrally connected via the holding frame by soldering. . A printed circuit board assembly structure, wherein the holding frame has a substantially L-shaped cross section with a bent piece formed on the outer edge, and a claw piece formed on the inner edge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431986U JPS62186485U (en) | 1986-05-16 | 1986-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7431986U JPS62186485U (en) | 1986-05-16 | 1986-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62186485U true JPS62186485U (en) | 1987-11-27 |
Family
ID=30919427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7431986U Pending JPS62186485U (en) | 1986-05-16 | 1986-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62186485U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03246994A (en) * | 1990-02-26 | 1991-11-05 | Matsushita Electric Ind Co Ltd | Electronic apparatus |
-
1986
- 1986-05-16 JP JP7431986U patent/JPS62186485U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03246994A (en) * | 1990-02-26 | 1991-11-05 | Matsushita Electric Ind Co Ltd | Electronic apparatus |