JPS63149567U - - Google Patents

Info

Publication number
JPS63149567U
JPS63149567U JP4098687U JP4098687U JPS63149567U JP S63149567 U JPS63149567 U JP S63149567U JP 4098687 U JP4098687 U JP 4098687U JP 4098687 U JP4098687 U JP 4098687U JP S63149567 U JPS63149567 U JP S63149567U
Authority
JP
Japan
Prior art keywords
chip component
package
land
edge
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4098687U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4098687U priority Critical patent/JPS63149567U/ja
Publication of JPS63149567U publication Critical patent/JPS63149567U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案のチツプ部品の斜視図、第2図
は同チツプ部品の半田デイツプ状態を示す側面図
、第3図は従来のチツプ部品の斜視図、第4図は
従来のチツプ部品の半田デイツプ状態を示す側面
図である。 2……プリント基板、3……リード部品、4…
…チツプ部品。
Figure 1 is a perspective view of the chip component of the present invention, Figure 2 is a side view of the same chip component showing a solder dip state, Figure 3 is a perspective view of a conventional chip component, and Figure 4 is a perspective view of a conventional chip component. FIG. 3 is a side view showing a solder dip state. 2...Printed circuit board, 3...Lead parts, 4...
...Chip parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラツトパツケージ型のチツプ部品であつてそ
のパツケージの端縁部に半田呼込用のランドが設
けられたことを特徴とするチツプ部品。
A chip component that is a flat package type chip component, and is characterized in that a land for attracting solder is provided at the edge of the package.
JP4098687U 1987-03-20 1987-03-20 Pending JPS63149567U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4098687U JPS63149567U (en) 1987-03-20 1987-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4098687U JPS63149567U (en) 1987-03-20 1987-03-20

Publications (1)

Publication Number Publication Date
JPS63149567U true JPS63149567U (en) 1988-10-03

Family

ID=30855570

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4098687U Pending JPS63149567U (en) 1987-03-20 1987-03-20

Country Status (1)

Country Link
JP (1) JPS63149567U (en)

Similar Documents

Publication Publication Date Title
JPS62112179U (en)
JPH0418474U (en)
JPS63149567U (en)
JPH0359648U (en)
JPH02132971U (en)
JPS62140791U (en)
JPS6379628U (en)
JPH03102762U (en)
JPH0217854U (en)
JPS63118201U (en)
JPS6219776U (en)
JPS6375068U (en)
JPS61192458U (en)
JPH01112571U (en)
JPH0465453U (en)
JPH0371653U (en)
JPS62109479U (en)
JPH0158955U (en)
JPS6454327U (en)
JPH0215719U (en)
JPH0412680U (en)
JPS6349230U (en)
JPS62162849U (en)
JPS6265801U (en)
JPS6249267U (en)