JPS63149567U - - Google Patents
Info
- Publication number
- JPS63149567U JPS63149567U JP4098687U JP4098687U JPS63149567U JP S63149567 U JPS63149567 U JP S63149567U JP 4098687 U JP4098687 U JP 4098687U JP 4098687 U JP4098687 U JP 4098687U JP S63149567 U JPS63149567 U JP S63149567U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- package
- land
- edge
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案のチツプ部品の斜視図、第2図
は同チツプ部品の半田デイツプ状態を示す側面図
、第3図は従来のチツプ部品の斜視図、第4図は
従来のチツプ部品の半田デイツプ状態を示す側面
図である。
2……プリント基板、3……リード部品、4…
…チツプ部品。
Figure 1 is a perspective view of the chip component of the present invention, Figure 2 is a side view of the same chip component showing a solder dip state, Figure 3 is a perspective view of a conventional chip component, and Figure 4 is a perspective view of a conventional chip component. FIG. 3 is a side view showing a solder dip state. 2...Printed circuit board, 3...Lead parts, 4...
...Chip parts.
Claims (1)
のパツケージの端縁部に半田呼込用のランドが設
けられたことを特徴とするチツプ部品。 A chip component that is a flat package type chip component, and is characterized in that a land for attracting solder is provided at the edge of the package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4098687U JPS63149567U (en) | 1987-03-20 | 1987-03-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4098687U JPS63149567U (en) | 1987-03-20 | 1987-03-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63149567U true JPS63149567U (en) | 1988-10-03 |
Family
ID=30855570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4098687U Pending JPS63149567U (en) | 1987-03-20 | 1987-03-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63149567U (en) |
-
1987
- 1987-03-20 JP JP4098687U patent/JPS63149567U/ja active Pending