JPS61114848U - - Google Patents
Info
- Publication number
- JPS61114848U JPS61114848U JP20149584U JP20149584U JPS61114848U JP S61114848 U JPS61114848 U JP S61114848U JP 20149584 U JP20149584 U JP 20149584U JP 20149584 U JP20149584 U JP 20149584U JP S61114848 U JPS61114848 U JP S61114848U
- Authority
- JP
- Japan
- Prior art keywords
- component body
- leads
- view
- cutouts
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 2
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案に係る電子部品を装着させた表
面実装部品の斜視図、第２図はリードの部分拡大
斜視図第３図は他の実施例を示すリードの部分拡
大斜視図第４図は他の実施例を示すリードの部分
拡大平面図、第５図は半田付け不良状態を示す縦
断面図、第６図は半田付け良好状態を示す平面図
である。
５……リード、５２……切欠、５３……透孔、
２，３，４……電子部品。
FIG. 1 is a perspective view of a surface mount component mounted with an electronic component according to the present invention, FIG. 2 is a partially enlarged perspective view of a lead, and FIG. 3 is a partially enlarged perspective view of a lead showing another embodiment. 5 is a partially enlarged plan view of a lead showing another embodiment, FIG. 5 is a vertical sectional view showing a poor soldering state, and FIG. 6 is a plan view showing a good soldering state. 5...Lead, 52...Notch, 53...Through hole,
2, 3, 4...Electronic parts.
Claims (1)
前記部品本体を含む主要部を外装材で被覆したも
のにおいて、前記リードに半田ウエツト性の悪い
形状の切欠もしくは透孔を形成したことを特徴と
する電子部品。 A plurality of leads extend from the component body and the main part including the component body is covered with an exterior material, characterized in that the leads are formed with cutouts or through holes having a shape that has poor solder wetability. electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20149584U JPS61114848U (en) | 1984-12-28 | 1984-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20149584U JPS61114848U (en) | 1984-12-28 | 1984-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61114848U true JPS61114848U (en) | 1986-07-19 |
Family
ID=30763341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20149584U Pending JPS61114848U (en) | 1984-12-28 | 1984-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61114848U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889850A (en) * | 1981-11-24 | 1983-05-28 | Hitachi Ltd | Face mounting type semiconductor device |
-
1984
- 1984-12-28 JP JP20149584U patent/JPS61114848U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889850A (en) * | 1981-11-24 | 1983-05-28 | Hitachi Ltd | Face mounting type semiconductor device |