JPS63174989U - - Google Patents

Info

Publication number
JPS63174989U
JPS63174989U JP6221587U JP6221587U JPS63174989U JP S63174989 U JPS63174989 U JP S63174989U JP 6221587 U JP6221587 U JP 6221587U JP 6221587 U JP6221587 U JP 6221587U JP S63174989 U JPS63174989 U JP S63174989U
Authority
JP
Japan
Prior art keywords
soldering agent
solder
welding
board
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6221587U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6221587U priority Critical patent/JPS63174989U/ja
Publication of JPS63174989U publication Critical patent/JPS63174989U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の斜視図、第2図は、本考案
を真上から見た平面図、第3図は、本考案を直線
a―bで切つた縦断面図、第4図は、本考案を直
線c―dで切つた縦断面図、第5図は、本考案の
実施例2を真上から見た平面図、第6図は、従来
のはんだの斜視図である。 1……本体、2……穴、3……フラツクス、4
……棒の部分。
Figure 1 is a perspective view of the present invention, Figure 2 is a plan view of the present invention seen from directly above, Figure 3 is a vertical cross-sectional view of the present invention taken along straight line a-b, and Figure 4 is , FIG. 5 is a plan view of the second embodiment of the present invention viewed from directly above, and FIG. 6 is a perspective view of a conventional solder. 1...Body, 2...Hole, 3...Flux, 4
...the part of the stick.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品の基板実装に供するはんだ剤において
、そのはんだ剤の形状を、複数個のリングが平面
的に横につながつた形とし、溶接に必要な量のフ
ラツクスが付帯していることを特徴とするはんだ
A soldering agent used for mounting electronic components on a board is characterized in that the shape of the soldering agent is in the form of a plurality of rings connected horizontally in a plane, and the amount of flux necessary for welding is attached. Solder.
JP6221587U 1987-04-23 1987-04-23 Pending JPS63174989U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6221587U JPS63174989U (en) 1987-04-23 1987-04-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6221587U JPS63174989U (en) 1987-04-23 1987-04-23

Publications (1)

Publication Number Publication Date
JPS63174989U true JPS63174989U (en) 1988-11-14

Family

ID=30896275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6221587U Pending JPS63174989U (en) 1987-04-23 1987-04-23

Country Status (1)

Country Link
JP (1) JPS63174989U (en)

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