JPH0164862U - - Google Patents
Info
- Publication number
- JPH0164862U JPH0164862U JP1987161033U JP16103387U JPH0164862U JP H0164862 U JPH0164862 U JP H0164862U JP 1987161033 U JP1987161033 U JP 1987161033U JP 16103387 U JP16103387 U JP 16103387U JP H0164862 U JPH0164862 U JP H0164862U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- utility
- scope
- registration request
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の外観図、第２図は従来の外観
図である。
１……からげ部分、２……ソルダカツプ部。
FIG. 1 is an external view of the present invention, and FIG. 2 is an external view of a conventional device. 1... Karaage part, 2... Solder cup part.
Claims (1)
いて、端子にハンダカツプを有することを特徴と
する端子。 1. A terminal for connecting and soldering wiring wires, characterized in that the terminal has a solder cup.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161033U JPH0164862U (en) | 1987-10-20 | 1987-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161033U JPH0164862U (en) | 1987-10-20 | 1987-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0164862U true JPH0164862U (en) | 1989-04-26 |
Family
ID=31443624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161033U Pending JPH0164862U (en) | 1987-10-20 | 1987-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0164862U (en) |
-
1987
- 1987-10-20 JP JP1987161033U patent/JPH0164862U/ja active Pending