JPS63159870U - - Google Patents
Info
- Publication number
- JPS63159870U JPS63159870U JP5292087U JP5292087U JPS63159870U JP S63159870 U JPS63159870 U JP S63159870U JP 5292087 U JP5292087 U JP 5292087U JP 5292087 U JP5292087 U JP 5292087U JP S63159870 U JPS63159870 U JP S63159870U
- Authority
- JP
- Japan
- Prior art keywords
- recess
- electrode
- metal film
- layer
- approximately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000605 extraction Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例の平面図、第２図は
第１図のＡ―Ａ′線断面図、第３図は第１図によ
る半田付状態を示すＡ―Ａ′線断面図、第４図は
従来の引出し電極構造の断面図である。
１……ガラス基板、２……凹部、３……引出し
電極層、４……保護膜、５……金属膜層、６……
フレキシブルケーブル、７……半田。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a sectional view taken along the line A-A' in Fig. 1, and Fig. 3 is a sectional view taken along the line A-A' showing the soldered state shown in Fig. 1. , FIG. 4 is a sectional view of a conventional extraction electrode structure. DESCRIPTION OF SYMBOLS 1... Glass substrate, 2... Recessed part, 3... Extraction electrode layer, 4... Protective film, 5... Metal film layer, 6...
Flexible cable, 7...solder.
Claims (1)
のほぼ中央に凹部を設け、前記凹部の底部に金属
膜層を形成することを特徴とする電極構造。 An electrode structure for an extraction electrode of an electronic component, characterized in that a recess is provided at approximately the center of the lower part of an electrode layer, and a metal film layer is formed at the bottom of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5292087U JPS63159870U (en) | 1987-04-07 | 1987-04-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5292087U JPS63159870U (en) | 1987-04-07 | 1987-04-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63159870U true JPS63159870U (en) | 1988-10-19 |
Family
ID=30878514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5292087U Pending JPS63159870U (en) | 1987-04-07 | 1987-04-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63159870U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
-
1987
- 1987-04-07 JP JP5292087U patent/JPS63159870U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09232737A (en) * | 1996-02-28 | 1997-09-05 | Hitachi Aic Inc | Printed-wiring board |
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