JPH0465459U - - Google Patents
Info
- Publication number
- JPH0465459U JPH0465459U JP10782490U JP10782490U JPH0465459U JP H0465459 U JPH0465459 U JP H0465459U JP 10782490 U JP10782490 U JP 10782490U JP 10782490 U JP10782490 U JP 10782490U JP H0465459 U JPH0465459 U JP H0465459U
- Authority
- JP
- Japan
- Prior art keywords
- metal film
- dielectric film
- film
- dielectric
- film provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 8
- 239000003990 capacitor Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
第１図ａは、本考案の一実施例を示す平面図、
第１図ｂは第１図ａのＸ―Ｘ線断面図、第２図は
一実施例の変形を示す断面図、第３図ａは従来例
を示す平面図、第３図ｂは第３図ａのＸ―Ｘ線断
面図である。
１……基板、２……第１金属膜、３……第１誘
電体膜、４……第２金属膜、５……第２誘電体膜
、６……第３誘電体膜、７……下層配線、８……
誘電体膜、９……上層配線。
FIG. 1a is a plan view showing an embodiment of the present invention;
Fig. 1b is a sectional view taken along the line X--X of Fig. 1a, Fig. 2 is a sectional view showing a modification of one embodiment, Fig. 3a is a plan view showing a conventional example, and Fig. 3b is a sectional view of the third embodiment. FIG. 3 is a sectional view taken along the line XX in FIG. DESCRIPTION OF SYMBOLS 1... Substrate, 2... First metal film, 3... First dielectric film, 4... Second metal film, 5... Second dielectric film, 6... Third dielectric film, 7... ...lower layer wiring, 8...
Dielectric film, 9... upper layer wiring.
Claims (1)
設けられた第１誘電体膜と、前記第１誘電体膜上
に設けられた第２金属膜からなる一方の電極と、
前記第２金属膜上に設けられた第２誘電体膜と、
前記第２誘電体膜上に設けられた第３の金属膜及
び前記第１金属膜からなる他方の電極とを有する
ことを特徴とする集積回路用キヤパシタ。 one electrode consisting of a first metal film of a predetermined layer order, a first dielectric film provided on the first metal film, and a second metal film provided on the first dielectric film;
a second dielectric film provided on the second metal film;
A capacitor for an integrated circuit, comprising a third metal film provided on the second dielectric film and the other electrode made of the first metal film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10782490U JPH0465459U (en) | 1990-10-15 | 1990-10-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10782490U JPH0465459U (en) | 1990-10-15 | 1990-10-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0465459U true JPH0465459U (en) | 1992-06-08 |
Family
ID=31854514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10782490U Pending JPH0465459U (en) | 1990-10-15 | 1990-10-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0465459U (en) |
-
1990
- 1990-10-15 JP JP10782490U patent/JPH0465459U/ja active Pending
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