JPS63118231U - - Google Patents
Info
- Publication number
- JPS63118231U JPS63118231U JP840287U JP840287U JPS63118231U JP S63118231 U JPS63118231 U JP S63118231U JP 840287 U JP840287 U JP 840287U JP 840287 U JP840287 U JP 840287U JP S63118231 U JPS63118231 U JP S63118231U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- etching
- portion formed
- stepped portion
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図のＡ―Ａ線断面図、第３図は本考案の
他の実施例を示す平面図、第４図は第３図のＢ―
Ｂ線断面図、第５図は従来例を示す平面図、第６
図は第５図のＣ―Ｃ線断面図である。
１……金属配線、２……絶縁膜段差部、３……
導電性残留物又は付着物、４……下地絶縁膜、５
……上地絶縁膜、６……絶縁膜突部。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along line A--A in FIG. 1, FIG. 3 is a plan view showing another embodiment of the present invention, and FIG.
A sectional view taken along line B, Fig. 5 is a plan view showing the conventional example, Fig. 6 is
The figure is a sectional view taken along the line CC in FIG. 1...Metal wiring, 2...Insulating film step portion, 3...
Conductive residue or deposit, 4... base insulating film, 5
... Upper insulating film, 6... Insulating film protrusion.
Claims (1)
おいて、絶縁膜食刻により形成される段差部に突
部を設けることを特徴とする半導体素子。 1. A semiconductor device having a stepped portion formed by etching an insulating film, wherein a protrusion is provided in the stepped portion formed by etching the insulating film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP840287U JPS63118231U (en) | 1987-01-22 | 1987-01-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP840287U JPS63118231U (en) | 1987-01-22 | 1987-01-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63118231U true JPS63118231U (en) | 1988-07-30 |
Family
ID=30792744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP840287U Pending JPS63118231U (en) | 1987-01-22 | 1987-01-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63118231U (en) |
-
1987
- 1987-01-22 JP JP840287U patent/JPS63118231U/ja active Pending