JPS6242243U - - Google Patents

Info

Publication number
JPS6242243U
JPS6242243U JP13474285U JP13474285U JPS6242243U JP S6242243 U JPS6242243 U JP S6242243U JP 13474285 U JP13474285 U JP 13474285U JP 13474285 U JP13474285 U JP 13474285U JP S6242243 U JPS6242243 U JP S6242243U
Authority
JP
Japan
Prior art keywords
oxide film
base electrode
insulating oxide
multilayer wiring
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13474285U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13474285U priority Critical patent/JPS6242243U/ja
Publication of JPS6242243U publication Critical patent/JPS6242243U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の第一の実施例を示す断面図
、第2図a〜gはその作成プロセスを工程順に示
す断面図、第3図はこの考案の第二の実施例を示
す断面図、第4図a〜gはその作成プロセスを工
程順に示す断面図、第5図は従来例を示す断面図
である。 5……基板、6……下地電極、7……絶縁酸化
物膜、9……層間絶縁膜、11……上部電極、1
2b……下地電極。
Figure 1 is a sectional view showing the first embodiment of this invention, Figures 2 a to g are sectional views showing the manufacturing process in order of steps, and Figure 3 is a sectional view showing the second embodiment of this invention. , FIGS. 4a to 4g are cross-sectional views showing the manufacturing process in the order of steps, and FIG. 5 is a cross-sectional view showing a conventional example. 5... Substrate, 6... Base electrode, 7... Insulating oxide film, 9... Interlayer insulating film, 11... Upper electrode, 1
2b... Base electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に少なくとも下地電極と層間絶縁膜と上
部電極とを有する多層配線デバイスにおいて、前
記下地電極をAl、Ti又はTaの金属材料によ
り形成し、この下地電極上に上部電極に対するコ
ンタクトホール部を除いて絶縁酸化物膜を形成し
、この絶縁酸化物膜上に層間絶縁膜を形成したこ
とを特徴とする多層配線デバイス。
In a multilayer wiring device having at least a base electrode, an interlayer insulating film, and an upper electrode on a substrate, the base electrode is formed of a metal material such as Al, Ti, or Ta, and a contact hole portion for the upper electrode is formed on the base electrode. 1. A multilayer wiring device characterized in that an insulating oxide film is formed using the insulating oxide film, and an interlayer insulating film is formed on the insulating oxide film.
JP13474285U 1985-09-03 1985-09-03 Pending JPS6242243U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13474285U JPS6242243U (en) 1985-09-03 1985-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13474285U JPS6242243U (en) 1985-09-03 1985-09-03

Publications (1)

Publication Number Publication Date
JPS6242243U true JPS6242243U (en) 1987-03-13

Family

ID=31036267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13474285U Pending JPS6242243U (en) 1985-09-03 1985-09-03

Country Status (1)

Country Link
JP (1) JPS6242243U (en)

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