JPH0322406U - - Google Patents

Info

Publication number
JPH0322406U
JPH0322406U JP8340789U JP8340789U JPH0322406U JP H0322406 U JPH0322406 U JP H0322406U JP 8340789 U JP8340789 U JP 8340789U JP 8340789 U JP8340789 U JP 8340789U JP H0322406 U JPH0322406 U JP H0322406U
Authority
JP
Japan
Prior art keywords
dielectric layer
conductive layer
strip
insulating substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8340789U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8340789U priority Critical patent/JPH0322406U/ja
Publication of JPH0322406U publication Critical patent/JPH0322406U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a〜cは本考案の実施例に係るストリツ
プ線路の制作手順を示す断面図である。また、第
2図は従来例のストリツプ線路を示す断面図であ
る。 図における符号1……絶縁基板、2……導電体
層、3……誘電体層、4……ストリツプ導電体層
である。
FIGS. 1a to 1c are cross-sectional views showing the steps for manufacturing a strip line according to an embodiment of the present invention. Further, FIG. 2 is a sectional view showing a conventional strip line. Reference numerals 1 in the figure indicate an insulating substrate, 2... a conductor layer, 3... a dielectric layer, and 4... a strip conductor layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベースとなる絶縁基板の表面を全面的に覆う導
電体層及び誘電体層を順次積み重ねて形成し、か
つ、この誘電体層の表面上にストリツプ導電体層
を形成したことを特徴とするストリツプ線路。
A strip line characterized in that a conductive layer and a dielectric layer are sequentially stacked to cover the entire surface of an insulating substrate serving as a base, and a strip conductive layer is formed on the surface of the dielectric layer. .
JP8340789U 1989-07-14 1989-07-14 Pending JPH0322406U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8340789U JPH0322406U (en) 1989-07-14 1989-07-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8340789U JPH0322406U (en) 1989-07-14 1989-07-14

Publications (1)

Publication Number Publication Date
JPH0322406U true JPH0322406U (en) 1991-03-07

Family

ID=31631052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8340789U Pending JPH0322406U (en) 1989-07-14 1989-07-14

Country Status (1)

Country Link
JP (1) JPH0322406U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002177603A (en) * 2000-12-12 2002-06-25 Heiwa Corp Game ball feeding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002177603A (en) * 2000-12-12 2002-06-25 Heiwa Corp Game ball feeding device

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